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BLF8G27LS-150GV

NXP Semiconductors

BLF8G27LS-150GV by NXP Semiconductors

RF Small Signal Field-Effect Transistors; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Moisture Sensitivity Level (MSL): NOT APPLICABLE;

Median Price

$25.012

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$25.012

1k+ parts

-

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100

-

$25.012

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Distributors (In-Stock)

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Vyrian

USA . 5,435 parts In-Stock

1+ parts

-

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5,435

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Anansix

USA . 2,680 parts In-Stock

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2,680

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Digiode

USA . 1,541 parts In-Stock

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1,541

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Distributors (Availability)

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UNI Independent Distributors

Spain . 6,440 parts In-Stock

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6,440

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Corphita

USA . 2,977 parts In-Stock

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2,977

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Northwest PG Solutions

USA . 753 parts In-Stock

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753

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Native Components

USA . 739 parts In-Stock

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739

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Technical Specifications

RF Small Signal Field Effect Transistors (FET) BLF8G27LS-150GV attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

BLF8G27LS-150GV Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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