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BF245A/0

NXP Semiconductors

BF245A/0 by NXP Semiconductors

BF245A/0 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 30V, operates in depletion mode, and supports very high frequencies. With a cylindrical package and 3 terminals, it ensures reliable performance up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,329 parts In-Stock

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1,329

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Vyrian

USA . 317 parts In-Stock

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317

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Anansix

USA . 253 parts In-Stock

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253

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Distributors (Availability)

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Native Components

USA . 450 parts In-Stock

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$0.096

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$0.092

450

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$0.092

Northwest PG Solutions

USA . 169 parts In-Stock

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$0.105

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$0.093

169

$0.105

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$0.093

One Stop Electronics

USA . 800 parts In-Stock

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$44.050

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800

$44.050

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Corphita

USA . 4,518 parts In-Stock

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UNI Independent Distributors

Spain . 614 parts In-Stock

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614

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Overview

Elevate your designs with the BF245A/0 by NXP Semiconductors, a premier choice in RF small signal FETs. Renowned for quality and reliability, NXP brings you the performance that empowers amplifiers and ensures optimal signal handling in high-frequency applications. Its robust construction and efficient design make it ideal for a variety of electronics, offering exceptional value and durability to enhance your projects seamlessly. Choose excellence; choose NXP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and durability, making it suitable for various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer better performance, providing higher efficiency and faster operation for amplifiers.

Configuration: SINGLE

The single configuration simplifies design and integration into circuits, making it a versatile choice for various applications.

Transistor Application: AMPLIFIER

Ideal for amplifier applications, this FET can enhance signal strength and improve overall circuit performance.

Minimum DS Breakdown Voltage: 30 V

The 30 V breakdown voltage ensures reliability and stability in circuits that may encounter voltage spikes.

Package Shape: ROUND

The round package shape can provide better thermal dissipation and mechanical stability in various mounting conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easier soldering and provide robust connections, making it suitable for prototyping and assembly.

Operating Mode: DEPLETION MODE

The depletion mode operation allows for versatile control of the current flow, making the FET adaptable for various circuit designs.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Capable of operating in very high frequency applications, this FET is suitable for advanced communication and RF applications.

No. of Terminals: 3

The three-terminal design provides straightforward integration into circuits, allowing for simple configuration and connections.

Maximum Power Dissipation (Abs): 0.3 W

With a power dissipation of 0.3 W, this FET is efficient in low-power applications, making it energy-friendly.

Package Style (Meter): CYLINDRICAL

The cylindrical package style aids in effective heat management and provides a compact footprint for circuit design.

Field Effect Transistor Technology: JUNCTION

Junction technology enhances the efficiency and performance of the transistor, ensuring reliable operation in various scenarios.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures that the FET can function in demanding environments without failure.

Transistor Element Material: SILICON

Silicon as the element material contributes to the overall reliability and performance, favoring cost-effective manufacturing.

Maximum Drain Current (ID): 0.025 A

With a maximum drain current of 0.025 A, this FET is optimized for low-power applications, ensuring minimal energy waste.

Terminal Position: BOTTOM

Bottom terminal positioning offers flexibility in PCB design and helps in effective space utilization on circuit boards.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF245A/0 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.025 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF245A/0 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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