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BF998WR-TAPE-13

NXP Semiconductors

BF998WR-TAPE-13 by NXP Semiconductors

BF998WR-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 12V min DS breakdown voltage, operates in the ultra-high frequency band, and supports dual gate depletion mode. This compact surface mount transistor ensures reliable performance up to 150 °C.

Median Price

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3

In-Stock Inventory

1k+

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Digiode

USA . 3,793 parts In-Stock

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Anansix

USA . 2,072 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 801 parts In-Stock

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UNI Independent Distributors

Spain . 6,816 parts In-Stock

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Corphita

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Northwest PG Solutions

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Native Components

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Overview

Elevate your designs with the BF998WR-TAPE-13 from NXP Semiconductors, a premium RF Small Signal FET known for its exceptional quality and reliability. Ideal for amplifier applications, this N-channel transistor features a unique dual-gate design for enhanced performance in ultra-high frequency ranges. With NXP's renowned innovation and expertise, you gain not just a product but a valuable ally in delivering robust, efficient solutions that stand the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are often faster and have higher electron mobility, resulting in better performance in switching and amplification applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection and functionality, making this FET ideal for applications requiring protection against reverse polarity.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor excels in applications requiring high linearity and low noise.

Surface Mount: YES

Surface mount technology allows for compact designs and automated manufacturing processes, leading to reduced costs and improved reliability.

Minimum DS Breakdown Voltage: 12 V

A minimum breakdown voltage of 12 V ensures device safety in circuits operating at high voltages, expanding its usability.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs and efficient space utilization on PCBs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and solderability, enhancing the ease of assembly and reliability of connections.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate configuration allows for enhanced control of the device, resulting in improved performance in RF applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in ultra-high frequency bands makes this FET ideal for advanced communication systems and high-speed applications.

No. of Terminals: 4

With 4 terminals, this transistor offers versatile connection options, simplifying circuit design and integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps minimize PCB real estate usage, making it suitable for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low power consumption and high efficiency, further enhancing the overall performance of the device.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows this FET to function reliably in harsh environments, providing adaptability across applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its excellent electrical properties, contributing to the robustness of this FET.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET can efficiently handle a reasonable amount of current, making it suitable for low-power applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and layout, enhancing ease of use in various applications.

Case Connection: SOURCE

The source case connection facilitates easier signal routing in designs, simplifying the implementation and performance of the circuit.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998WR-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF998WR-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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