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3SK167

Onsemi

3SK167 by Onsemi

3SK167 by Onsemi is an N-CHANNEL RF FET with max drain current of 0.055A and power dissipation of 0.2W. Ideal for applications requiring high-frequency signal amplification in electronic devices operating up to 125 °C ambient temperature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,881 parts In-Stock

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Digiode

USA . 217 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 726 parts In-Stock

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$0.488

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$0.468

726

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$0.468

Northwest PG Solutions

USA . 60 parts In-Stock

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$0.536

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$0.473

60

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$0.473

Metaverse IC Inc.

Canada . 306,000 parts In-Stock

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306,000

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Kulean Microsystems

USA . 8,246 parts In-Stock

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Problanco Electronics

Mexico . 8,194 parts In-Stock

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SupplyDigital Components

Austria . 7,128 parts In-Stock

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TANS Electronics

Latvia . 2,624 parts In-Stock

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Corphita

USA . 1,100 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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UHIMA Technologies

Türkiye . 97 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Onsemi 3SK167 RF Small Signal Field Effect Transistor. Designed with precision and expertise by Onsemi, a trusted industry leader, this N-CHANNEL transistor offers superior performance and reliability in a compact package. Ideal for a wide range of applications, this FET delivers seamless functionality and efficiency. Elevate your projects with the value and benefits that the 3SK167 brings to the table. Experience innovation at its finest with Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are generally more efficient and have lower ON-state resistance compared to P-CHANNEL, making them suitable for high-performance applications.

Maximum Drain Current (Abs) (ID): 0.055 A

The high maximum drain current allows the transistor to handle higher currents, making it suitable for applications that require a higher power output.

Field Effect Transistor Technology: METAL SEMICONDUCTOR

METAL SEMICONDUCTOR FETs typically have good linearity and low noise characteristics, making them suitable for applications requiring precision and low noise performance.

Maximum Power Dissipation Ambient: 0.2 W

The high maximum power dissipation allows the transistor to handle heat dissipation effectively, making it suitable for applications where heat dissipation is a concern.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the transistor to operate in high-temperature environments, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 0.055 A

The maximum drain current rating indicates the current-carrying capacity of the transistor, making it suitable for applications that require high current handling capability.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 3SK167 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

.055 A

Maximum Drain Current (ID):

.055 A

Field Effect Transistor Technology:

METAL SEMICONDUCTOR

Maximum Operating Temperature:

125 Cel

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.2 W

Sub-Category:

FET RF Small Signal

Trade Compliance

3SK167 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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