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BF545C-TAPE-7

NXP Semiconductors

BF545C-TAPE-7 by NXP Semiconductors

BF545C-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a min DS breakdown voltage of 30V, operates in depletion mode, and supports very high frequency bands. This compact surface mount transistor ensures reliable performance up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,858 parts In-Stock

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Digiode

USA . 1,632 parts In-Stock

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Anansix

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One Stop Electronics

USA . 922 parts In-Stock

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$30.050

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UNI Independent Distributors

Spain . 6,770 parts In-Stock

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Corphita

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Native Components

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Northwest PG Solutions

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Overview

Elevate your designs with the BF545C-TAPE-7 from NXP Semiconductors, a leading name in innovation. This versatile RF Small Signal FET excels in amplification applications, delivering outstanding performance in compact packages. With superior reliability and efficiency, it’s perfect for high-frequency projects while ensuring optimal thermal management. Trust in NXP's quality to enhance your electronics, offering exceptional value and paving the way for cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this FET suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, resulting in better performance for switching and amplification, enhancing efficiency.

Configuration: SINGLE

A single configuration simplifies design requirements, allowing for easier integration into circuits.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this FET is ideal for boosting weak signals, making it perfect for audio and RF applications.

Surface Mount: YES

Surface mount capability allows for higher density circuit designs and improved performance in automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

A minimum DS breakdown voltage of 30V provides ample headroom for stable operation in various high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, facilitating compact design solutions.

Terminal Form: GULL WING

Gull wing terminals enable easier soldering and better contact with the circuit board, enhancing reliability.

Operating Mode: DEPLETION MODE

Depletion mode operation offers unique functionality which can be advantageous for specific signal processing needs.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Support for very high frequency band operation makes this FET suitable for high-speed applications, such as RF communication.

No. of Terminals: 3

With three terminals, it allows for straightforward connectivity in simple circuits while maintaining functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact footprint, ideal for space-constrained designs.

Field Effect Transistor Technology: JUNCTION

Junction technology offers improved performance and stability, which is crucial for precision applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating allows this FET to function effectively in harsher environments.

Transistor Element Material: SILICON

Silicon as the element material gives excellent conductivity and thermal performance, making it reliable for various applications.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on printed circuit boards, allowing for optimized routing.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF545C-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF545C-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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