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MMBFU310LT3

Onsemi

MMBFU310LT3 by Onsemi

The Onsemi MMBFU310LT3 is an N-CHANNEL RF FET with 25V DS Breakdown Voltage. Ideal for AMPLIFIER applications, it operates in DEPLETION MODE at up to 150 °C. Featuring GULL WING terminals and a RECTANGULAR package, it has a Crss of 2.5 pF for high-frequency performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,223 parts In-Stock

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Digiode

USA . 1,183 parts In-Stock

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SupplyDigital Components

Austria . 3,168 parts In-Stock

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Kulean Microsystems

USA . 2,657 parts In-Stock

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TANS Electronics

Latvia . 1,387 parts In-Stock

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Corphita

USA . 1,286 parts In-Stock

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Problanco Electronics

Mexico . 1,057 parts In-Stock

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Corohmni

South Africa . 271 parts In-Stock

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UHIMA Technologies

Türkiye . 210 parts In-Stock

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Overview

Upgrade your amplifier with the MMBFU310LT3 by Onsemi, a high-quality RF Small Signal Field Effect Transistor that delivers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor offers superior amplification capabilities, making it ideal for various applications. With its advanced technology and durable construction, the MMBFU310LT3 ensures optimal functionality and longevity, providing exceptional value and benefits to customers seeking top-notch performance. Experience the difference with Onsemi's innovative transistor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the transistor lightweight and durable, making it suitable for portable and long-lasting applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and higher mobility compared to P-channel transistors, making this transistor a good choice for high-performance amplifier applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and reduces complexity, making it easier to integrate into various amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor offers high gain and low noise characteristics, making it ideal for signal amplification purposes.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and enabling high-density designs in modern electronic devices.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25 V, this transistor can handle higher voltages without risking damage, ensuring reliable operation in a variety of amplifier circuits.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy mounting and integration into electronic systems, enhancing compatibility and ease of use.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and robust mechanical connections, ensuring reliable electrical contact and stability in amplifier circuits.

Operating Mode: DEPLETION MODE

Depletion mode transistors offer better linearity and control over the signal amplification process, resulting in improved signal fidelity and performance in amplifier applications.

No. of Terminals: 3

With three terminals, this transistor provides the necessary connections for biasing and signal input/output, simplifying the circuit design and enhancing overall performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables compact designs, making it ideal for applications where size and weight are critical factors.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high frequency performance and low noise characteristics, making it well-suited for amplifier applications where signal integrity is crucial.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperatures without compromising performance, ensuring reliable operation in demanding environments.

Transistor Element Material: SILICON

Silicon transistors offer high gain, low noise, and good thermal stability, making them a popular choice for amplifier applications where performance and reliability are key.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and mechanical strength, ensuring secure connections and reliable performance in amplifier circuits.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting and routing of connections, enabling easy integration into amplifier circuits while maintaining signal integrity.

Maximum Feedback Capacitance (Crss): 2.5 pF

With a low maximum feedback capacitance of 2.5 pF, this transistor minimizes signal distortion and improves high-frequency response in amplifier circuits, ensuring clear and accurate signal amplification.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBFU310LT3 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBFU310LT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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