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3SK168C

Onsemi

3SK168C by Onsemi

3SK168C by Onsemi is an N-CHANNEL RF FET with max drain current of 0.055A and power dissipation of 0.25W. Ideal for applications requiring high frequency signal amplification in environments up to 125 °C, such as RF communication systems and radar equipment.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,802 parts In-Stock

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Kulean Microsystems

USA . 7,978 parts In-Stock

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TANS Electronics

Latvia . 7,941 parts In-Stock

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SupplyDigital Components

Austria . 4,118 parts In-Stock

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Corphita

USA . 1,449 parts In-Stock

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Problanco Electronics

Mexico . 1,333 parts In-Stock

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UHIMA Technologies

Türkiye . 732 parts In-Stock

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Northwest PG Solutions

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Native Components

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Corohmni

South Africa . 377 parts In-Stock

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Overview

Unleash the power of innovation with the 3SK168C RF Small Signal Field Effect Transistor by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers exceptional quality and reliability in every product. Ideal for a wide range of applications, this N-CHANNEL FET offers unmatched performance and efficiency. Experience seamless connectivity, improved signal processing, and enhanced functionality with the 3SK168C. Elevate your projects to new heights with this cutting-edge technology that provides unparalleled value and benefits to customers. Choose Onsemi for superior solutions that drive success.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer lower on-state resistance and higher current-carrying capability compared to P-CHANNEL FETs, making them suitable for high-power applications.

Maximum Drain Current (Abs) (ID): 0.055 A

The high maximum drain current allows for efficient operation under heavy load conditions, making this FET ideal for applications requiring high power output.

Field Effect Transistor Technology: METAL SEMICONDUCTOR

Metal semiconductor FETs offer better high-frequency performance and low noise levels, making them suitable for RF applications where signal integrity is crucial.

Maximum Power Dissipation Ambient: 0.25 W

The relatively high maximum power dissipation allows for effective heat dissipation, ensuring stable operation even in high-temperature environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range provides versatility in various operating conditions, making this FET reliable and durable for use in different environments.

Maximum Drain Current (ID): 0.055 A

The specified maximum drain current ensures safe and efficient operation within the rated limits, preventing overheating and ensuring long-term reliability.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 3SK168C attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

.055 A

Maximum Drain Current (ID):

.055 A

Field Effect Transistor Technology:

METAL SEMICONDUCTOR

Maximum Operating Temperature:

125 Cel

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.25 W

Sub-Category:

FET RF Small Signal

Trade Compliance

3SK168C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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