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3SK168B

Onsemi

3SK168B by Onsemi

3SK168B by Onsemi is an N-CHANNEL RF FET with max drain current of 0.055A and power dissipation of 0.25W. Ideal for applications requiring METAL SEMICONDUCTOR technology, operating up to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,674 parts In-Stock

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Vyrian

USA . 1,508 parts In-Stock

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Native Components

USA . 815 parts In-Stock

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$0.930

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815

$0.930

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Northwest PG Solutions

USA . 999 parts In-Stock

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$1.023

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$1.023

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TANS Electronics

Latvia . 7,520 parts In-Stock

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SupplyDigital Components

Austria . 7,268 parts In-Stock

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Problanco Electronics

Mexico . 3,755 parts In-Stock

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Kulean Microsystems

USA . 2,339 parts In-Stock

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Corphita

USA . 1,475 parts In-Stock

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Corohmni

South Africa . 287 parts In-Stock

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UHIMA Technologies

Türkiye . 204 parts In-Stock

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Overview

Unleash the power of innovation with the 3SK168B from Onsemi! Known for their exceptional quality and reliability, Onsemi has crafted this RF Small Signal Field Effect Transistor to deliver unrivaled performance in a variety of applications. Whether you're in need of N-CHANNEL technology for your project or seeking a METAL SEMICONDUCTOR solution, the 3SK168B offers maximum power dissipation and operating temperature to ensure optimal functionality. Elevate your designs with the precision and excellence that only Onsemi can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel transistors tend to have better performance and higher efficiency compared to P-Channel transistors, making this product a good choice for applications requiring high performance.

Maximum Drain Current (Abs) (ID): 0.055 A

With a high maximum drain current, this product can handle higher current loads, making it suitable for applications that require high power handling capabilities.

Field Effect Transistor Technology: METAL SEMICONDUCTOR

Metal semiconductor FETs offer better performance in terms of speed and power dissipation compared to other types, making this product suitable for high-speed applications.

Maximum Power Dissipation Ambient: 0.25 W

With a high maximum power dissipation, this product can handle higher power levels without overheating, making it suitable for applications that require high power handling capabilities.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can operate in harsh environments without compromising performance, making it suitable for industrial applications.

Maximum Drain Current (ID): 0.055 A

The high maximum drain current allows this product to handle high current loads, making it suitable for applications requiring high power handling capabilities.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 3SK168B attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

.055 A

Maximum Drain Current (ID):

.055 A

Field Effect Transistor Technology:

METAL SEMICONDUCTOR

Maximum Operating Temperature:

125 Cel

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.25 W

Sub-Category:

FET RF Small Signal

Trade Compliance

3SK168B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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