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BF244BRL

Onsemi

BF244BRL by Onsemi

BF244BRL by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage, ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND. It features SINGLE configuration, 0.1A ID, and DEPLETION MODE operation in a CYLINDRICAL package with TIN LEAD finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,175 parts In-Stock

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Vyrian

USA . 1,145 parts In-Stock

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Problanco Electronics

Mexico . 7,723 parts In-Stock

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SupplyDigital Components

Austria . 4,600 parts In-Stock

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Kulean Microsystems

USA . 3,857 parts In-Stock

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Corphita

USA . 2,365 parts In-Stock

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Northwest PG Solutions

USA . 1,738 parts In-Stock

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TANS Electronics

Latvia . 1,448 parts In-Stock

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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Native Components

USA . 892 parts In-Stock

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Corohmni

South Africa . 427 parts In-Stock

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Overview

Unlock the power of advanced technology with the BF244BRL by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in every product. The BF244BRL falls under the category of RF Small Signal Field Effect Transistors (FET) – perfect for amplifier applications in the ultra-high frequency band. With its N-channel configuration and depletion mode operation, this transistor offers exceptional performance and efficiency. Experience seamless connectivity and enhanced signal processing with the BF244BRL, delivering unmatched value and benefits to customers seeking superior electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and low drive power, making them a good choice for amplifier applications.

Configuration: SINGLE

Single configuration simplifies circuit design and ensures easier integration into existing systems.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and reliability in amplification tasks.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltage levels without breakdown, ensuring stability in operation.

Package Shape: ROUND

Round package shape offers better thermal dissipation and mechanical strength, making it suitable for rugged environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure easy and secure mounting on PCBs, providing a stable connection for the transistor.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy control of the current flow, enabling precise amplification in various circuit designs.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency bands, this transistor offers excellent performance in high-frequency applications, such as RF signal amplification.

No. of Terminals: 3

Having 3 terminals allows for easy hookup and integration into circuitry, ensuring a streamlined design process.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers compactness and ease of integration into various electronic devices, making it a versatile choice.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high input impedance and low output impedance, ideal for amplifier applications requiring high gain.

Transistor Element Material: SILICON

Silicon material ensures reliable and consistent performance, making this transistor suitable for long-term use in amplifiers.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and corrosion resistance, ensuring a secure and durable connection in circuits.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1A, this transistor can handle moderate current loads, suitable for various amplifier applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy heat dissipation and connection to the circuit board, ensuring stable operation under varying conditions.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF244BRL attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF244BRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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