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BF909WR,115

NXP Semiconductors

BF909WR,115 by NXP Semiconductors

BF909WR,115 by NXP Semiconductors is an N-CHANNEL RF Small Signal FET with a PLASTIC/EPOXY package. It operates in DUAL GATE, ENHANCEMENT MODE for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. Featuring a max Drain Current of 0.04 A and a Breakdown Voltage of 7 V, it is ideal for high-frequency circuit designs.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 3,000 parts In-Stock

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-

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$0.225

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$0.186

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$0.166

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$0.225

$0.186

$0.166

Verical

USA . 3,000 parts In-Stock

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$0.208

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$0.208

Chip1Stop

Japan . 5 parts In-Stock

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Digiode

USA . 4,503 parts In-Stock

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$0.175

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Vyrian

USA . 6,996 parts In-Stock

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Anansix

USA . 717 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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Corphita

USA . 1,962 parts In-Stock

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$0.166

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Native Components

USA . 398 parts In-Stock

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$0.774

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$0.774

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Northwest PG Solutions

USA . 1,311 parts In-Stock

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$0.852

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Corohmni

South Africa . 479 parts In-Stock

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$1.325

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$1.742

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$1.585

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$1.428

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$1.742

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AZTECH Wire

Italy . 1,026 parts In-Stock

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$19.310

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Perfect Parts

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Authorized Procurement Solutions

USA . 84,000 parts In-Stock

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GreenTree Electronics

Israel . 84,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

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$0.221

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Microchip USA

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UNI Independent Distributors

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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Glotronic Ltd.

UK . 80 parts In-Stock

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Overview

Looking to amplify your RF signal with ease and efficiency? Look no further than the BF909WR,115 by NXP Semiconductors. Crafted with precision and expertise, this N-CHANNEL FET is designed for high performance in ultra-high frequency applications. With a dual gate, enhancement mode operating mode and maximum drain current of 0.04 A, this transistor offers unrivaled quality and reliability. Whether you're working on amplifiers or other RF devices, the BF909WR,115 guarantees top-notch results, making it the perfect choice for your next project. Experience the difference with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for portable and rugged applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors generally have higher mobility and conductivity compared to P-Channel transistors, making them more efficient for amplification purposes.

Configuration: COMPLEX

The complex configuration allows for intricate circuit designs and specialized applications where multiple functions are required.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification tasks.

Surface Mount: YES

The surface mount capability makes installation easier and more convenient, especially in compact electronic devices.

Minimum DS Breakdown Voltage: 7 V

The minimum breakdown voltage of 7V ensures reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on circuit boards and easy alignment during assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high performance and low power consumption, making it suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments without sacrificing performance.

Maximum Drain Current: 0.04 A

The maximum drain current of 0.04A ensures sufficient power handling capability for various amplifier and signal processing tasks.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF909WR,115 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (Abs) (ID):

.04 A

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.05 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF909WR,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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