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BF245CRL

Onsemi

BF245CRL by Onsemi

BF245CRL by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it has a max ID of 0.1A and operates in DEPLETION MODE. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

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Digiode

USA . 958 parts In-Stock

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TANS Electronics

Latvia . 3,529 parts In-Stock

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SupplyDigital Components

Austria . 2,947 parts In-Stock

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Kulean Microsystems

USA . 645 parts In-Stock

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Native Components

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UHIMA Technologies

Türkiye . 417 parts In-Stock

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Corohmni

South Africa . 294 parts In-Stock

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Corphita

USA . 79 parts In-Stock

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Problanco Electronics

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Northwest PG Solutions

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Overview

Elevate your RF signal amplification with the BF245CRL by Onsemi. This high-quality N-CHANNEL FET boasts a sleek round package design and operates in ultra-high frequency bands, making it ideal for a wide range of amplifier applications. With Onsemi's reputation for reliability and innovation, you can trust that this transistor will deliver top-notch performance. Experience the value and benefits of superior signal processing technology with the BF245CRL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good mechanical strength and insulation properties, making the transistor durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower ON-resistance compared to P-channel FETs, making this transistor a good choice for amplifier applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to use in amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in signal amplification tasks.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this transistor can handle higher voltages, providing reliability and safety in operation.

Package Shape: ROUND

Round package shape allows for easy mounting and thermal dissipation, improving overall performance and reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easy soldering and reliable connections, ensuring stable performance in amplifier circuits.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for simple biasing and control, making it suitable for amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, providing excellent signal amplification in high-frequency circuits.

No. of Terminals: 3

3 terminals provide easy connection and control, simplifying circuit design and integration.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers compact design and efficient heat dissipation, enhancing overall performance and reliability.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides low noise and high input impedance, making it ideal for amplifier applications.

Transistor Element Material: SILICON

Silicon material offers excellent thermal and electrical properties, ensuring stable performance in amplifier circuits.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections in amplifier circuits.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1A, this transistor can handle moderate power levels, making it suitable for amplifier applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and soldering, ensuring reliable connections in amplifier circuits.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF245CRL attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF245CRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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