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BF556A,215

NXP Semiconductors

BF556A,215 by NXP Semiconductors

BF556A,215 by NXP Semiconductors is an N-CHANNEL RF FET for AMPLIFIER applications. It operates in DEPLETION MODE with a 30V DS Breakdown Voltage and can handle up to 0.25W power dissipation. This SMALL OUTLINE transistor has a max operating temperature of 150°C and is designed for VERY HIGH FREQUENCY BAND usage.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.250

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100

$0.250

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Cyclops Electronics Ltd

UK . 14,550 parts In-Stock

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14,550

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Vyrian

USA . 5,562 parts In-Stock

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Digiode

USA . 4,879 parts In-Stock

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4,879

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Avant Electronics Limited

UK . 3,000 parts In-Stock

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Anansix

USA . 1,393 parts In-Stock

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VNN

France . 715 parts In-Stock

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Greenchips

USA . 667 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$0.250

100+ parts

$0.238

1k+ parts

$0.226

10k+ parts

$0.222

40

$0.250

$0.238

$0.226

$0.222

Andel Nordic

Denmark . 277 parts In-Stock

1+ parts

$1.971

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$1.892

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$1.892

277

$1.971

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$1.892

$1.892

One Stop Electronics

USA . 928 parts In-Stock

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$7.050

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928

$7.050

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AZTECH Wire

Italy . 641 parts In-Stock

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$14.904

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Perfect Parts

USA . 87,349 parts In-Stock

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Lixinc

USA . 12,059 parts In-Stock

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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UNI Independent Distributors

Spain . 5,678 parts In-Stock

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Corphita

USA . 3,603 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,911 parts In-Stock

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Microchip USA

USA . 205 parts In-Stock

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Overview

Enhance the performance of your RF amplifiers with the BF556A,215 by NXP Semiconductors. Crafted with precision and expertise, this N-CHANNEL Field Effect Transistor offers exceptional quality and reliability for a wide range of applications in the VERY HIGH FREQUENCY BAND. Experience seamless operation and improved efficiency with the SINGLE configuration and DEPLETION MODE design. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds expectations, providing you with value, benefits, and advantages that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good insulation and protection for the transistor, making it more durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel type offers better performance and efficiency in many amplifier applications compared to P-channel transistors.

Configuration: SINGLE

Single configuration simplifies design and reduces complexity in circuit layouts.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplification circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 30 V

30V minimum breakdown voltage ensures the transistor can handle higher voltages, increasing its versatility in various applications.

Package Shape: RECTANGULAR

Rectangular package shape offers compatibility with standard PCB layouts and makes it easy to mount the transistor securely.

Terminal Form: GULL WING

Gull wing terminal form provides robust connection points for soldering, ensuring reliable electrical contacts.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy biasing and control of the transistor, making it suitable for various circuit designs.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Very high-frequency band capability enables the transistor to be used in demanding applications that require fast signal processing.

No. of Terminals: 3

Three terminals provide simple connectivity in circuits, reducing installation and maintenance complexity.

Maximum Power Dissipation (Abs): 0.25 W

0.25W maximum power dissipation allows the transistor to handle high power levels without overheating, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact circuit designs.

Field Effect Transistor Technology: JUNCTION

Junction technology offers high performance and efficiency in signal amplification applications, making it a reliable choice for amplifiers.

Maximum Operating Temperature: 150 °C

150°C maximum operating temperature ensures the transistor can withstand high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon material in the transistor element provides good electrical properties and reliability, ensuring stable performance over time.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and corrosion resistance, extending the lifespan of the transistor.

Terminal Position: DUAL

Dual terminal position allows for flexible soldering and easy connection to other components, enabling versatile circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering and component integration during PCB assembly.

Peak Reflow Temperature °C: 260

260°C peak reflow temperature capability enables reliable soldering of the transistor to the PCB, ensuring strong electrical connections.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF556A,215 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF556A,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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