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MMBF5484LT3

Onsemi

MMBF5484LT3 by Onsemi

MMBF5484LT3 by Onsemi is an N-CHANNEL RF FET with DEPLETION MODE. It has a max power dissipation of 0.225W and operates b/w -55 to 150 °C. Ideal for AMPLIFIER applications, this transistor features GULL WING terminals in a SMALL OUTLINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,619 parts In-Stock

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Vyrian

USA . 116 parts In-Stock

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TANS Electronics

Latvia . 8,265 parts In-Stock

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Kulean Microsystems

USA . 7,723 parts In-Stock

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SupplyDigital Components

Austria . 4,362 parts In-Stock

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Corphita

USA . 2,402 parts In-Stock

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UHIMA Technologies

Türkiye . 580 parts In-Stock

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Corohmni

South Africa . 179 parts In-Stock

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Problanco Electronics

Mexico . 89 parts In-Stock

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Overview

Enhance your electronic projects with the MMBF5484LT3 by Onsemi, a top-quality RF Small Signal Field Effect Transistor that delivers outstanding performance and reliability. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL transistor is perfect for amplifier applications. With its unique DEPLETION MODE operating mode and small outline package style, the MMBF5484LT3 offers exceptional value and benefits to customers seeking high-quality components for their projects. Upgrade your designs today with the superior quality and advanced technology of Onsemi's MMBF5484LT3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel type transistors are known for their high electron mobility, making them ideal for high-frequency applications such as amplifiers.

Configuration: SINGLE

Single configuration simplifies the circuit design and reduces complexity, making it easier to integrate into various electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and reliability in amplification tasks.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto printed circuit boards, saving space and increasing efficiency.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to mount and secure the transistor in electronic devices, ensuring a streamlined design.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for precise control over the transistor's conductivity, making it suitable for a wide range of applications.

Field Effect Transistor Technology: JUNCTION

Junction technology provides high performance and reliability in RF signal amplification, making it a preferred choice for many applications.

Maximum Power Dissipation Ambient: 0.225 W

With a maximum power dissipation of 0.225W, this transistor can handle high-power applications without overheating or performance degradation.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150 °C, ensuring stable performance even in harsh environmental conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent electrical properties, including high gain and low noise, making them ideal for RF signal amplification.

Minimum Operating Temperature: -55 °C

Capable of operating at temperatures as low as -55 °C, ensuring reliable performance in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and conductivity, ensuring a secure connection in the circuit.

Maximum Feedback Capacitance (Crss): 1 pF

Low feedback capacitance of 1pF helps reduce the risk of instability and oscillation in amplifier circuits, ensuring reliable performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBF5484LT3 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.225 W

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBF5484LT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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