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BF244ARLRM

Onsemi

BF244ARLRM by Onsemi

BF244ARLRM by Onsemi is an N-CHANNEL FET with 30V DS Breakdown Voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features DEPLETION MODE operation and 0.1A ID. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

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1k+

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Vyrian

USA . 1,860 parts In-Stock

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Digiode

USA . 1,250 parts In-Stock

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Native Components

USA . 754 parts In-Stock

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$1.986

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754

$1.986

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Northwest PG Solutions

USA . 956 parts In-Stock

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$2.185

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Kulean Microsystems

USA . 8,091 parts In-Stock

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SupplyDigital Components

Austria . 7,550 parts In-Stock

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Problanco Electronics

Mexico . 2,552 parts In-Stock

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Corphita

USA . 1,255 parts In-Stock

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TANS Electronics

Latvia . 694 parts In-Stock

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UHIMA Technologies

Türkiye . 445 parts In-Stock

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Corohmni

South Africa . 247 parts In-Stock

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Overview

Unleash the power of high-quality RF Small Signal Field Effect Transistors with the Onsemi BF244ARLRM. Manufactured by the trusted brand Onsemi, this N-CHANNEL transistor offers unparalleled performance in amplifier applications. With a minimum DS breakdown voltage of 30V and operating in depletion mode, this transistor is perfect for ultra high frequency band applications. Its cylindrical package body material ensures durability while its through-hole terminal form makes installation a breeze. Elevate your projects with the reliability and precision of the BF244ARLRM from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher mobility and faster switching speeds compared to P-channel transistors, making them ideal for applications requiring high performance.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces complexity, making it easier to integrate this transistor into different amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, this transistor offers high gain and low noise performance, making it suitable for audio and RF signal amplification.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this transistor can handle higher voltages without failure, ensuring reliable operation in various amplifier circuits.

Package Shape: ROUND

The round package shape provides easy handling and mounting options, making it convenient for assembly and integration into amplifier systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and secure connection to the circuit board, ensuring stable electrical connections for optimal amplifier performance.

Operating Mode: DEPLETION MODE

Depletion mode transistors offer high input impedance and low leakage current, making them suitable for amplifier applications where high signal fidelity is important.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency operation, this transistor is ideal for RF amplifier applications where high-frequency signal amplification is required.

No. of Terminals: 3

With three terminals, this transistor offers flexibility in circuit design and connection options, allowing for versatile amplifier configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact form factor and efficient heat dissipation, making it suitable for space-constrained amplifier designs.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low noise performance, making this transistor suitable for high-gain amplifier applications.

Transistor Element Material: SILICON

Silicon transistors offer high reliability, temperature stability, and easy integration into semiconductor processes, making them a popular choice for amplifier applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides corrosion resistance and solderability, ensuring reliable electrical connections and long-term performance in amplifier circuits.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1 A, this transistor can handle higher current levels, making it suitable for medium-power amplifier applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and heat sinking, making it easier to integrate this transistor into amplifier systems for efficient heat dissipation.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF244ARLRM attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF244ARLRM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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