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BF245A

Onsemi

BF245A by Onsemi

N-CHANNEL; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): .3 W; Field Effect Transistor Technology: JUNCTION; Package Style (Meter): CYLINDRICAL;

Median Price

$9.100

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 196 parts In-Stock

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$9.100

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ComSIT USA

USA . 21,700 parts In-Stock

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ComSIT Distribution GmbH

Germany . 19,700 parts In-Stock

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Digiode

USA . 7,149 parts In-Stock

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Vyrian

USA . 6,125 parts In-Stock

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Anansix

USA . 3,182 parts In-Stock

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Chip Stock

USA . 1,125 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 1,035 parts In-Stock

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Manotoh

Italy . 603 parts In-Stock

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Huijzer Components

Netherlands . 375 parts In-Stock

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Pegasus Components GmbH

Germany . 357 parts In-Stock

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Infinite Electronics LLP

India . 200 parts In-Stock

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LittleDiode

UK . 137 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 56 parts In-Stock

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56

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Holdelec - ElecDif-Pro

France . 56 parts In-Stock

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Sinequanon

UK . 43 parts In-Stock

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GES GmbH

Germany . 21 parts In-Stock

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ECAB

Sweden . 12 parts In-Stock

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ABC Electronics Ltd.

UK . 6 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 1,959 parts In-Stock

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$0.077

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$0.074

1,959

$0.077

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$0.074

Parana Technologies

USA . 1,955 parts In-Stock

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$0.767

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$1.764

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1,955

$0.767

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$1.764

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DigiPath Technology Company

USA . 121 parts In-Stock

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$0.845

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$0.777

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121

$0.845

$0.777

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ChromeModa Solutions

Germany . 3,048 parts In-Stock

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$0.862

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$0.707

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3,048

$0.862

$0.707

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IDEA Electronic Components Group

UK . 1,307 parts In-Stock

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$0.862

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$0.776

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Corohmni

South Africa . 252 parts In-Stock

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$1.055

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Modulus Dynamics

Lithuania . 24,973 parts In-Stock

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$1.671

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$1.604

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$1.537

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Northwest PG Solutions

USA . 6,177 parts In-Stock

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$1.974

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Advanced Electronics

New Zealand . 99 parts In-Stock

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$2.264

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$2.060

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$1.856

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99

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AZTECH Wire

Italy . 556 parts In-Stock

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$11.203

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556

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One Stop Electronics

USA . 1,474 parts In-Stock

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$23.050

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QUARKTWIN TECHNOLOGY LTD

USA . 24,413 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,628 parts In-Stock

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SupplyDigital Components

Austria . 6,281 parts In-Stock

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TANS Electronics

Latvia . 5,462 parts In-Stock

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Corphita

USA . 4,505 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,282 parts In-Stock

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UNI Independent Distributors

Spain . 2,829 parts In-Stock

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Problanco Electronics

Mexico . 2,753 parts In-Stock

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Supply Digital

USA . 1,624 parts In-Stock

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Kulean Microsystems

USA . 952 parts In-Stock

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952

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Assy Fe

Spain . 665 parts In-Stock

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Perfect Parts

USA . 504 parts In-Stock

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504

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UHIMA Technologies

Türkiye . 357 parts In-Stock

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Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF245A attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF245A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-187-0788, 5961011870788, 5961-15-135-0230, 5961151350230, 5961-17-038-5080, 5961170385080

NIIN

011870788, 151350230, 170385080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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