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BF1100WR-TAPE-7

NXP Semiconductors

BF1100WR-TAPE-7 by NXP Semiconductors

BF1100WR-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 14V, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device excels in high-temperature environments up to 150 °C.

Median Price

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3

In-Stock Inventory

1k+

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Digiode

USA . 2,389 parts In-Stock

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Vyrian

USA . 1,008 parts In-Stock

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Anansix

USA . 254 parts In-Stock

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One Stop Electronics

USA . 423 parts In-Stock

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Corphita

USA . 4,552 parts In-Stock

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UNI Independent Distributors

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Native Components

USA . 796 parts In-Stock

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Northwest PG Solutions

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Overview

Unlock superior performance with the BF1100WR-TAPE-7 from NXP Semiconductors, a leader in innovative solutions. Designed for applications requiring high-frequency amplification, this N-channel FET ensures reliability and efficiency, making it ideal for RF circuits. Its compact surface-mount design simplifies integration, while NXP’s commitment to quality guarantees outstanding longevity and performance. Elevate your projects with a product that combines cutting-edge technology and exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent durability and protection against environmental factors, making it suitable for a range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and have lower on-resistance compared to their P-channel counterparts, making this device suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances circuit protection and functionality, simplifying design requirements for engineers.

Transistor Application: AMPLIFIER

Designed for amplification, this FET can efficiently boost signal strengths, making it ideal for audio and RF applications.

Surface Mount: YES

Surface mount technology allows for automated assembly processes, reducing production costs and enabling compact circuit designs.

Minimum DS Breakdown Voltage: 14 V

A minimum breakdown voltage of 14 V provides added reliability in applications where voltage spikes may occur, ensuring stable operation.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient PCB layout and maximizes space utilization on the board.

Terminal Form: GULL WING

Gull-wing terminals ensure strong mechanical and electrical connections, enhancing the overall reliability of the transistor in circuit applications.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate and enhancement mode operation provide flexibility and improved performance for RF amplification applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Optimized for ultra-high frequency applications, this FET is an excellent choice for advanced communication systems and RF applications.

No. of Terminals: 4

A 4-terminal design simplifies connectivity and integration into various circuit configurations, providing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in minimizing space requirements on circuit boards, making it suitable for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to lower power consumption and higher switching speeds, making this FET ideal for energy-efficient designs.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliable performance even in high-temperature conditions, enhancing durability.

Transistor Element Material: SILICON

Silicon as the transistor element material offers excellent electrical properties and availability, resulting in reliable performance.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET is optimized for low-power applications without sacrificing performance.

Terminal Position: DUAL

Dual terminal positioning allows for efficient signal routing and improves overall circuit performance.

Case Connection: SOURCE

The source case connection simplifies circuit design and enhances device stability in various applications.

Maximum Feedback Capacitance (Crss): 0.035 pF

Low feedback capacitance minimizes unwanted feedback effects, maintaining signal integrity at high frequencies.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF1100WR-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

14 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.035 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF1100WR-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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