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2N5486RL1

Onsemi

2N5486RL1 by Onsemi

2N5486RL1 by Onsemi is an N-CHANNEL RF FET with a single configuration for AMPLIFIER applications. Featuring a PLASTIC/EPOXY package, it operates in DEPLETION MODE at up to 150 °C. With a Gp of 10 dB and Crss of 1 pF, this transistor is ideal for ULTRA HIGH FREQUENCY BAND usage.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,394 parts In-Stock

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Digiode

USA . 1,464 parts In-Stock

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Northwest PG Solutions

USA . 1,250 parts In-Stock

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Kulean Microsystems

USA . 3,661 parts In-Stock

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Problanco Electronics

Mexico . 3,425 parts In-Stock

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Corphita

USA . 2,221 parts In-Stock

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SupplyDigital Components

Austria . 2,194 parts In-Stock

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TANS Electronics

Latvia . 1,076 parts In-Stock

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UHIMA Technologies

Türkiye . 430 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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Native Components

USA . 213 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the 2N5486RL1 RF Small Signal Field Effect Transistor by Onsemi. Known for their cutting-edge technology and superior quality, Onsemi delivers top-notch performance in every product. Ideal for amplifier applications in the ultra-high frequency band, this N-CHANNEL transistor offers a minimum power gain of 10 dB, ensuring optimal signal amplification. With its cylindrical package shape and through-hole terminal form, the 2N5486RL1 provides ease of installation and exceptional reliability. Experience unparalleled efficiency and precision with this high-performance transistor, designed to elevate your RF projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides good protection for the transistor, making it durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, making them suitable for high-frequency applications.

Configuration: SINGLE

Single configuration simplifies circuit design and layout.

Transistor Application: AMPLIFIER

Designed specifically for amplification applications, ensuring optimal performance.

Minimum Power Gain (Gp): 10 dB

Minimum power gain of 10 dB indicates good amplification capability.

Package Shape: ROUND

Round package shape allows for easy installation and integration into various systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy biasing and control of the transistor.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, providing excellent signal amplification at high frequencies.

No. of Terminals: 3

Three terminals allow for easy connections and versatility in circuit design.

Package Style (Meter): CYLINDRICAL

Cylindrical package style is compact and easy to handle.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high-performance characteristics for amplification applications.

Maximum Operating Temperature: 150 °C

Operating temperature up to 150 °C ensures reliable performance in various environments.

Transistor Element Material: SILICON

Silicon material offers good thermal conductivity and electrical properties for optimal transistor performance.

Maximum Drain Current (ID): 0.03 A

Maximum drain current of 0.03 A allows for sufficient current handling capability.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to mount the transistor on a PCB.

Maximum Feedback Capacitance (Crss): 1 pF

Low feedback capacitance of 1 pF reduces the risk of oscillations and ensures stable performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 2N5486RL1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Minimum Power Gain (Gp):

10 dB

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2N5486RL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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