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BF1100WR-TAPE-13

NXP Semiconductors

BF1100WR-TAPE-13 by NXP Semiconductors

BF1100WR-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 14V, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,443 parts In-Stock

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Anansix

USA . 2,858 parts In-Stock

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Vyrian

USA . 64 parts In-Stock

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One Stop Electronics

USA . 148 parts In-Stock

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$59.050

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Corphita

USA . 3,442 parts In-Stock

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UNI Independent Distributors

Spain . 2,774 parts In-Stock

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Northwest PG Solutions

USA . 1,805 parts In-Stock

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Native Components

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Overview

Elevate your RF applications with the BF1100WR-TAPE-13 from NXP Semiconductors, a leader in innovative technology. This high-quality N-channel FET delivers exceptional performance for amplifiers in ultra-high frequency bands, ensuring reliable operation even in demanding conditions. With its compact design and built-in diode, it offers seamless integration and enhanced efficiency, making it the perfect choice for cutting-edge electronics. Experience the reliability and excellence that NXP brings to every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and helps protect the component in various environments, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance characteristics and lower on-resistance, making them ideal for amplification applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection and functionality, allowing for more versatile circuit designs without additional components.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized for high performance in audio and RF applications.

Surface Mount: YES

Surface mount technology allows for automated assembly and compact designs, which are essential in modern electronic devices.

Minimum DS Breakdown Voltage: 14 V

A breakdown voltage of 14 V indicates good safety margins for many applications, allowing it to function reliably in higher voltage environments.

Package Shape: RECTANGULAR

Rectangular package shapes offer efficient space utilization on PCBs, making layout easier and more flexible.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and help improve mechanical stability, which is advantageous for manufacturing and overall reliability.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

Dual gate enhances RF performance, allowing for better signal integrity and noise reduction, ideal for sensitive applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in UHF bands makes this FET excellent for high-frequency applications such as RF transmitters and receivers.

No. of Terminals: 4

Having 4 terminals provides flexibility for various circuit designs, allowing for better integration and performance in multiple configurations.

Package Style (Meter): SMALL OUTLINE

Small outline packages save board space and reduce weight, making them perfect for compact electronic solutions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low noise, critical for effective signal amplification.

Maximum Operating Temperature: 150 °C

A high maximum temperature rating ensures that the FET can operate in demanding environments, enhancing its durability and longevity.

Transistor Element Material: SILICON

Silicon transistors are well-established in the industry, offering good performance at a reasonable cost with excellent thermal stability.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET is suitable for low-power applications, ensuring efficient energy use.

Terminal Position: DUAL

Dual terminal positions provide design versatility, enhancing circuit configuration options and optimizing layout.

Case Connection: SOURCE

Source connection type simplifies circuit architecture while ensuring efficient signal flow in applications.

Maximum Feedback Capacitance (Crss): 0.035 pF

Low feedback capacitance minimizes signal degradation and enhances frequency response, making it ideal for high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF1100WR-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

14 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.035 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF1100WR-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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