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BF991

NXP Semiconductors

BF991 by NXP Semiconductors

The NXP Semiconductors BF991 is an N-CHANNEL RF FET with a built-in diode, ideal for amplifier applications. Operating in DUAL GATE DEPLETION MODE, it offers a max drain current of 0.02 A and can handle up to 150 °C operating temperature. This small outline transistor features a very high frequency band and tin terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 30,000 parts In-Stock

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Digiode

USA . 3,738 parts In-Stock

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NexGen Digital

USA . 3,105 parts In-Stock

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Cogito LLC

Ukraine . 2,220 parts In-Stock

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Anansix

USA . 1,780 parts In-Stock

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1,780

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R&J Components

USA . 1,733 parts In-Stock

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1,733

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Fibra_Brandt Electronic GMBH

Germany . 1,580 parts In-Stock

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VNN

France . 959 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Huijzer Components

Netherlands . 260 parts In-Stock

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Vyrian

USA . 193 parts In-Stock

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ABC Electronics Ltd.

UK . 163 parts In-Stock

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GES GmbH

Germany . 20 parts In-Stock

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One Stop Electronics

USA . 530 parts In-Stock

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$1.050

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530

$1.050

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Corohmni

South Africa . 749 parts In-Stock

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$11.880

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Semicontronic

India . 501 parts In-Stock

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$20.050

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$19.549

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$19.448

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Lixinc

USA . 5,156 parts In-Stock

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Continental Prestige Electronics

USA . 4,220 parts In-Stock

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Corphita

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Argo Parts USA

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Assy Fe

Spain . 3,083 parts In-Stock

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Kepictronics

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UNI Independent Distributors

Spain . 2,694 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Experience superior performance and reliability with the BF991 by NXP Semiconductors, a top-tier RF Small Signal Field Effect Transistor. Perfect for amplifier applications, this single-channel transistor boasts a built-in diode and operates in depletion mode for optimal functionality. With a high-frequency band and a small outline package style, this transistor delivers exceptional results in very demanding environments. Trust in NXP Semiconductors for cutting-edge technology and innovative solutions that enhance your projects. Unlock the full potential of your designs with the BF991 transistor and see the difference it can make in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances functionality and can be useful in certain amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and improving overall design efficiency.

Minimum DS Breakdown Voltage: 20 V

With a breakdown voltage of 20 V, this transistor can withstand higher voltage levels without failing.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Capable of operating in very high frequency bands, making it suitable for applications requiring fast signal processing.

Maximum Drain Current (Abs) (ID): 0.02 A

With a maximum drain current of 0.02 A, this transistor can handle moderate current levels effectively.

Maximum Power Dissipation (Abs): 0.2 W

This transistor has a maximum power dissipation of 0.2 W, allowing it to operate efficiently without overheating.

Package Style (Meter): SMALL OUTLINE

The compact small outline package style saves space and is ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high temperatures without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides reliable performance and low power consumption in electronic devices.

Terminal Finish: Tin (Sn)

Tin terminal finish offers good solderability and corrosion resistance, ensuring a strong and stable connection.

Case Connection: SOURCE

The source connection simplifies circuit design and improves signal integrity in amplifier applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF991 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.02 A

Maximum Drain Current (ID):

.02 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF991 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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