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MMBF5486D87Z

Onsemi

MMBF5486D87Z by Onsemi

MMBF5486D87Z by Onsemi is an N-CHANNEL RF FET with DEPLETION MODE operation. It operates in ULTRA HIGH FREQUENCY BAND, with PLASTIC/EPOXY package and GULL WING terminals. Ideal for SWITCHING applications due to its low 1 pF feedback capacitance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 1,837 parts In-Stock

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Vyrian

USA . 864 parts In-Stock

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Anansix

USA . 151 parts In-Stock

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SupplyDigital Components

Austria . 7,915 parts In-Stock

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TANS Electronics

Latvia . 5,076 parts In-Stock

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Kulean Microsystems

USA . 3,927 parts In-Stock

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Problanco Electronics

Mexico . 3,006 parts In-Stock

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Corphita

USA . 2,252 parts In-Stock

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Supply Digital

USA . 665 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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UHIMA Technologies

Türkiye . 454 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MMBF5486D87Z by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality RF Small Signal Field Effect Transistors that are perfect for a wide range of applications. From switching to ultra high frequency band operations, this N-CHANNEL transistor offers unmatched performance and reliability. With its compact size and advanced technology, the MMBF5486D87Z is designed to meet your needs and exceed your expectations. Experience the value and benefits of choosing Onsemi for all your electronic component needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics and lower resistance compared to P-channel transistors.

Configuration: SINGLE

Simplified circuit design with a single transistor configuration.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring fast operation and efficiency.

Surface Mount: YES

Easy to mount on printed circuit boards, saving space and allowing for automated assembly processes.

Package Shape: RECTANGULAR

Compact and space-efficient design for easy integration into electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections for reliable performance.

Operating Mode: DEPLETION MODE

Depletion mode transistors are normally ON, which can be advantageous in certain circuit designs.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for high-frequency applications, offering enhanced performance in ultra-high frequency ranges.

No. of Terminals: 3

Simple 3-terminal design for straightforward circuit connections.

Package Style (Meter): SMALL OUTLINE

Compact package style for space-constrained applications and easy PCB layout.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides good performance characteristics for various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable operation in various environmental conditions.

Transistor Element Material: SILICON

Silicon material offers good thermal and electrical properties for efficient transistor operation.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connections.

Maximum Feedback Capacitance (Crss): 1 pF

Low feedback capacitance minimizes signal interference and ensures stable performance in high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBF5486D87Z attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMBF5486D87Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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