Loading...

BF998-TAPE-13

NXP Semiconductors

BF998-TAPE-13 by NXP Semiconductors

BF998-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 12V min DS breakdown voltage, operates in the ultra-high frequency band, and supports dual gate depletion mode. This compact surface mount transistor ensures reliable performance up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,729

-

-

-

-

Vyrian

USA . 3,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,570

-

-

-

-

Anansix

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

874

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,978 parts In-Stock

1+ parts

$2.823

100+ parts

-

1k+ parts

-

10k+ parts

-

1,978

$2.823

-

-

-

One Stop Electronics

USA . 1,410 parts In-Stock

1+ parts

$58.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,410

$58.050

-

-

-

UNI Independent Distributors

Spain . 6,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,460

-

-

-

-

Corphita

USA . 4,302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,302

-

-

-

-

Native Components

USA . 370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.490

10k+ parts

-

370

-

-

$2.490

-

Overview

Elevate your designs with the BF998-TAPE-13 from NXP Semiconductors, a leader in innovative RF solutions. This top-tier N-channel FET offers exceptional performance for amplifying signals in ultra-high frequency applications. With its compact surface mount design and reliable construction, you can trust this transistor to deliver unmatched efficiency and durability. Choose NXP for quality you can depend on, and empower your projects with unparalleled reliability and versatility.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent durability and resistance to environmental factors, ensuring long-term reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally preferred for high-speed switching and amplifying applications, making this transistor suitable for a variety of circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse polarity and spikes, contributing to the reliability of the device in circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is ideal for signal processing applications, enhancing overall performance in audio and RF systems.

Surface Mount: YES

Being a surface mount device, it facilitates compact PCB designs, enabling high-density circuit layouts and improved manufacturability.

Minimum DS Breakdown Voltage: 12 V

The minimum drain-source breakdown voltage ensures that the device can handle sufficient voltage levels, adding to the versatility for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCB, optimizing circuit design and layout flexibility.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and provide reliable mechanical connections, simplifying assembly in manufacturing.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate configuration in depletion mode offers enhanced control over the electrical characteristics, making the device suitable for specialized RF applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency band, this transistor is engineered for modern telecommunications and broadcasting systems with high frequency requirements.

No. of Terminals: 4

With four terminals, this transistor allows for versatile circuit configurations, supporting complex circuit designs while maintaining simplicity.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the footprint on the printed circuit board, making it ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology enables fast switching speeds and low power consumption, making this transistor efficient for various applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to function reliably in demanding thermal environments, reducing the risk of failure.

Transistor Element Material: SILICON

Silicon is widely used for its excellent electrical properties, ensuring stable performance over a wide range of temperatures and conditions.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET can handle moderate load conditions, making it suitable for various practical applications.

Terminal Position: DUAL

The dual terminal position facilitates easier connections in circuit boards, enhancing design flexibility while easing the manufacturing process.

Case Connection: SOURCE

Connecting the case to the source helps in heat dissipation, which is critical for maintaining performance and reliability in high-frequency operations.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF998-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20