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BF990A-TAPE-13

NXP Semiconductors

BF990A-TAPE-13 by NXP Semiconductors

BF990A-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications, featuring a dual gate and built-in diode. It operates at ultra-high frequencies with a max drain current of 30 mA and breakdown voltage of 18 V. This compact surface mount device ensures reliable performance in demanding environments up to 150 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Anansix

USA . 2,768 parts In-Stock

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Vyrian

USA . 97 parts In-Stock

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Digiode

USA . 67 parts In-Stock

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One Stop Electronics

USA . 488 parts In-Stock

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$62.050

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Native Components

USA . 73 parts In-Stock

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$99.660

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$95.674

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Northwest PG Solutions

USA . 687 parts In-Stock

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$109.626

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UNI Independent Distributors

Spain . 1,760 parts In-Stock

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Corphita

USA . 724 parts In-Stock

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Overview

Unlock the potential of your next project with the BF990A-TAPE-13 from NXP Semiconductors, a leader in innovative solutions. This high-quality RF small signal FET is designed for superior performance in amplifier applications, ensuring optimal signal clarity and reliability. With its compact surface mount design and exceptional durability, it’s perfect for ultra-high frequency tasks in modern electronics. Elevate your designs with trusted technology that delivers unmatched value and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and faster, making this product ideal for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection, ensuring reliability in applications where reverse polarity might occur.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this transistor delivers high gain and efficiency, perfect for audio and RF amplification.

Surface Mount: YES

The surface mount design makes it easy to integrate into compact circuit boards, saving space and improving performance in modern electronics.

Minimum DS Breakdown Voltage: 18 V

With a minimum breakdown voltage of 18 V, this FET can handle a variety of voltage levels, providing versatility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs and allows for efficient heat dissipation, enhancing performance during operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy automated soldering and improve reliability in connections, reducing the risk of failure.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate feature allows for sophisticated control over the transistor's operation, enhancing performance in RF applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency band, this FET is ideal for high-speed communication devices and radars.

No. of Terminals: 4

With four terminals, this transistor offers efficient connections for optimum signal routing in RF circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, allowing for use in compact applications without sacrificing performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high reliability, contributing to energy-efficient designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C allows this FET to function reliably in demanding environments.

Transistor Element Material: SILICON

Silicon as the element material guarantees a robust performance characterized by high efficiency and stability in various applications.

Maximum Drain Current (ID): 0.03 A

A maximum drain current of 0.03 A supports a wide range of applications while ensuring energy efficiency.

Terminal Position: DUAL

Dual terminal positioning facilitates better layout and integration in circuit designs, ensuring optimal performance and connection.

Case Connection: SOURCE

Having the case connected to the source enhances the thermal performance and simplifies the design layout in many applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF990A-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

18 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF990A-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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