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BF992-TAPE-13

NXP Semiconductors

BF992-TAPE-13 by NXP Semiconductors

BF992-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 20V, operates in dual gate mode, and supports very high frequency bands. This compact surface mount device ensures efficient performance with a max temp of 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,596 parts In-Stock

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1,596

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Vyrian

USA . 1,393 parts In-Stock

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Anansix

USA . 1,010 parts In-Stock

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1,010

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Native Components

USA . 233 parts In-Stock

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$0.255

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$0.245

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Northwest PG Solutions

USA . 2,337 parts In-Stock

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$0.280

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$0.247

2,337

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$0.247

One Stop Electronics

USA . 625 parts In-Stock

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$7.050

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625

$7.050

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UNI Independent Distributors

Spain . 4,558 parts In-Stock

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Corphita

USA . 1,870 parts In-Stock

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1,870

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Overview

Unlock the power of innovation with NXP Semiconductors’ BF992-TAPE-13, a top-tier RF small signal FET designed for exceptional performance in amplification applications. Renowned for their commitment to quality and reliability, NXP ensures this versatile device excels in very high frequency environments while offering seamless integration with its gull-wing terminals. Experience unparalleled efficiency and elevate your designs to new heights with the BF992-TAPE-13!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic epoxy material ensures robustness and protection from environmental factors, enhancing the longevity of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance, higher efficiency, and faster switching speeds compared to P-channel types, making this product suitable for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode facilitates efficient protection against reverse polarity, enhancing the reliability of the circuit.

Transistor Application: AMPLIFIER

Designed for amplification purposes, this FET can be used in various electronic applications, ensuring high-quality signal processing.

Surface Mount: YES

Surface mount technology allows for compact designs and is suitable for automated assembly, making integration into circuits more efficient.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V provides adequate voltage handling for a variety of applications, ensuring operational safety.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts, making it easier to design compact electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capabilities and reliable connections, contributing to the overall stability of the device.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate design in depletion mode allows for greater control over the signal gain and better performance in RF applications.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Suitable for very high frequency applications, this FET is perfect for RF amplification and ensures minimal signal distortion.

No. of Terminals: 4

Having 4 terminals offers necessary connectivity for effective circuit implementation and versatile use in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is efficient for space-constrained designs and allows for higher density PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low output capacitance, enhancing this device's performance in analog signal processing.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can function in demanding environments without performance degradation.

Transistor Element Material: SILICON

Silicon as a semiconductor material ensures good thermal stability and reliability in varied operating conditions.

Maximum Drain Current (ID): 0.04 A

A maximum drain current of 0.04A allows for good handling capabilities in low to moderate current applications.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and provides flexibility for circuit designs.

Case Connection: SOURCE

The source case connection allows for easy integration into common circuit configurations, facilitating design simplicity.

Maximum Feedback Capacitance (Crss): 0.04 pF

Low feedback capacitance (0.04 pF) minimizes attenuation and preserves signal integrity, making this FET suitable for high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF992-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.04 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF992-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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