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2N3819G

Onsemi

2N3819G by Onsemi

2N3819G by Onsemi is an N-CHANNEL FET with 25V DS Breakdown Voltage. It operates in DEPLETION MODE at 150 °C, ideal for ULTRA HIGH FREQUENCY AMPLIFIER applications. Featuring SINGLE configuration, it has 0.1A ID and a CYLINDRICAL package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,155 parts In-Stock

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2,155

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Vyrian

USA . 2,044 parts In-Stock

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2,044

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Distributors (Availability)

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Native Components

USA . 337 parts In-Stock

1+ parts

$0.437

100+ parts

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$0.420

337

$0.437

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$0.420

Northwest PG Solutions

USA . 1,087 parts In-Stock

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$0.481

100+ parts

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$0.424

1,087

$0.481

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$0.424

Problanco Electronics

Mexico . 5,783 parts In-Stock

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5,783

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SupplyDigital Components

Austria . 5,341 parts In-Stock

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5,341

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TANS Electronics

Latvia . 5,032 parts In-Stock

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5,032

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Kulean Microsystems

USA . 1,860 parts In-Stock

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1,860

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UHIMA Technologies

Türkiye . 577 parts In-Stock

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577

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Corohmni

South Africa . 442 parts In-Stock

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442

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Corphita

USA . 421 parts In-Stock

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421

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Overview

Transform your RF amplifier projects with the 2N3819G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality RF small signal field effect transistors that offer superior performance and reliability. Whether you're designing radio frequency circuits or amplifiers, this N-channel FET provides exceptional value with its ultra-high frequency band capabilities. Say goodbye to compromise and hello to top-notch quality with the 2N3819G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the transistor lightweight and durable, making it easy to handle and resistant to damage.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, making them suitable for high-frequency applications and amplifiers.

Configuration: SINGLE

The single configuration simplifies circuit design and implementation, making it easier to integrate into various electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and reliability in amplification tasks.

Minimum DS Breakdown Voltage: 25 V

The minimum breakdown voltage of 25V ensures reliable operation and protection against voltage spikes in the circuit.

Package Shape: ROUND

The round package shape allows for easy mounting and handling, making it suitable for a wide range of applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering and assembly process, making it suitable for DIY projects and professional applications.

Operating Mode: DEPLETION MODE

Operating in depletion mode allows for easy control of current flow, making it suitable for low power consumption applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, ensuring reliable performance in high-speed signal processing systems.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration into various circuit configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact form factor and easy mounting options, making it suitable for space-constrained applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low noise characteristics, making it ideal for sensitive signal amplification applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, the transistor can withstand high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability and performance, making them suitable for a wide range of electronic applications.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1A, the transistor can handle moderate current loads, making it suitable for low-power applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and soldering, making it easy to integrate into existing circuit designs.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 2N3819G attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-226

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2N3819G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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