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J211-D74Z

Onsemi

J211-D74Z by Onsemi

The Onsemi J211-D74Z is an N-CHANNEL RF FET with a PLASTIC/EPOXY package. Operating in DEPLETION MODE, it offers a max power dissipation of 0.35W and can handle temperatures up to 150°C. Ideal for AMPLIFIER applications in the VERY HIGH FREQUENCY BAND.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 187 parts In-Stock

1+ parts

$0.090

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187

$0.090

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Mouser Electronics

USA . 8,018 parts In-Stock

1+ parts

$0.280

100+ parts

$0.137

1k+ parts

$0.130

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8,018

$0.280

$0.137

$0.130

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Adafruit Industries

USA . 668 parts In-Stock

1+ parts

$160.926

100+ parts

$146.443

1k+ parts

$131.959

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668

$160.926

$146.443

$131.959

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Master Electronics

USA . 7,750 parts In-Stock

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$0.110

7,750

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$0.110

Verical

USA . 6,000 parts In-Stock

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$0.135

6,000

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$0.135

DigiKey

USA . 4,000 parts In-Stock

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$0.113

4,000

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$0.113

Rochester

USA . 3,040 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

3,040

-

$0.132

$0.110

$0.098

Chip1Stop

Japan . 187 parts In-Stock

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187

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Digiode

USA . 719 parts In-Stock

1+ parts

$0.086

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719

$0.086

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Vyrian

USA . 1,470 parts In-Stock

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$0.090

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1,470

$0.090

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Chip Stock

USA . 78,000 parts In-Stock

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78,000

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IBS Electronics

USA . 19,500 parts In-Stock

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$0.182

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$0.139

19,500

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$0.182

$0.139

Electro Sonic

Canada . 8,000 parts In-Stock

1+ parts

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100+ parts

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$0.122

10k+ parts

$0.104

8,000

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$0.122

$0.104

Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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NexGen Digital

USA . 2,899 parts In-Stock

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2,899

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Anansix

USA . 920 parts In-Stock

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920

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Corphita

USA . 2,238 parts In-Stock

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$0.081

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$0.081

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Corohmni

South Africa . 357 parts In-Stock

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$0.090

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357

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Perfect Parts

USA . 17,920 parts In-Stock

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17,920

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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TANS Electronics

Latvia . 6,512 parts In-Stock

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6,512

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Infinite Electronics LLP (Excess)

. 6,001 parts In-Stock

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6,001

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Problanco Electronics

Mexico . 2,015 parts In-Stock

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Supply Digital

USA . 1,365 parts In-Stock

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SupplyDigital Components

Austria . 1,359 parts In-Stock

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Kulean Microsystems

USA . 911 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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694

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Overview

Upgrade your RF amplification with the J211-D74Z by Onsemi. Designed with precision and reliability in mind, this N-CHANNEL FET boasts a single configuration for seamless integration into amplifier applications. With a maximum power dissipation of 0.35W and operating at very high frequencies, this transistor is perfect for achieving optimal performance in your projects. Trust Onsemi's expertise in semiconductor technology to deliver top-notch quality and value. Elevate your designs with the J211-D74Z and experience unparalleled efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides good protection for the transistor, making it durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and efficiency compared to P-channel transistors, making this product a good choice for amplification purposes.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes it easier to use this transistor in various amplifier applications.

Package Shape: ROUND

Round package shape allows for easy mounting and ensures a good thermal performance for the transistor.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance, low noise, and high gain, making it suitable for amplifier applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows this transistor to handle elevated temperatures without failure, increasing its reliability.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) J211-D74Z attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

J211-D74Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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