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BF909WR-TAPE-7

NXP Semiconductors

BF909WR-TAPE-7 by NXP Semiconductors

BF909WR-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 7V min DS breakdown voltage, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device ensures efficient performance with a max temp of 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,493 parts In-Stock

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4,493

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Digiode

USA . 3,665 parts In-Stock

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3,665

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Anansix

USA . 472 parts In-Stock

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472

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Native Components

USA . 495 parts In-Stock

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$1.382

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495

$1.382

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Northwest PG Solutions

USA . 1,821 parts In-Stock

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$1.520

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1,821

$1.520

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One Stop Electronics

USA . 1,589 parts In-Stock

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$56.050

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1,589

$56.050

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UNI Independent Distributors

Spain . 6,247 parts In-Stock

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Corphita

USA . 2,840 parts In-Stock

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Overview

Elevate your designs with the BF909WR-TAPE-7 from NXP Semiconductors—where quality meets innovation. This versatile RF Small Signal FET excels in amplifier applications, delivering exceptional performance in ultra-high frequency environments. With NXP's renowned reliability and advanced technology, experience seamless integration in your projects, boosting efficiency and ensuring durability. Unlock endless possibilities for your designs with a trusted partner committed to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better electron mobility, leading to improved efficiency and speed in performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from reverse polarity, enhancing reliability in various applications.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for applications requiring signal enhancement, making it versatile for audio and RF applications.

Surface Mount: YES

Surface mount technology allows for compact assembly on circuit boards, saving space and aiding in high-density designs.

Minimum DS Breakdown Voltage: 7 V

A 7 V breakdown voltage provides adequate protection against voltage spikes, ensuring reliability in sensitive circuitry.

Package Shape: RECTANGULAR

Rectangular packaging is space-efficient and provides straightforward placement in various circuit designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical stability during operation.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

Dual gate operation enhances flexibility, making it suitable for complex modulation schemes in communication devices.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for ultra-high frequency applications, this FET is ideal for modern wireless systems and RF communication.

No. of Terminals: 4

A four-terminal design allows for easier integration into multi-functional circuits, providing design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to compact circuit designs, making this FET ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input resistance and low power consumption, making it highly effective for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures stability and performance in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material provides excellent thermal stability and performance reliability under various operating conditions.

Maximum Drain Current (ID): 0.04 A

A maximum drain current of 0.04 A makes this FET suitable for low power applications while maintaining effectiveness.

Terminal Position: DUAL

Dual terminal positioning supports versatile circuit designs and layout configurations.

Case Connection: SOURCE

Having the source as the case connection simplifies the circuit design and provides a reliable grounding point.

Maximum Feedback Capacitance (Crss): 0.05 pF

A low feedback capacitance optimizes performance at high frequencies, making it ideal for RF applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF909WR-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.05 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF909WR-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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