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BF2030E6814HTSA1

Infineon Technologies

BF2030E6814HTSA1 by Infineon Technologies

Infineon's BF2030E6814HTSA1 is an N-CHANNEL RF FET with 10V DS Breakdown Voltage, 20dB Power Gain, and operates in the Ultra High Frequency Band. Ideal for AMPLIFIER applications, this transistor has a DUAL GATE configuration in PLASTIC/EPOXY package with GULL WING terminals.

Median Price

$0.101

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,765 parts In-Stock

1+ parts

-

100+ parts

$0.105

1k+ parts

$0.087

10k+ parts

$0.078

11,765

-

$0.105

$0.087

$0.078

Verical

USA . 11,765 parts In-Stock

1+ parts

-

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10k+ parts

$0.097

11,765

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$0.097

Distributors (In-Stock)

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Digiode

USA . 412 parts In-Stock

1+ parts

$0.082

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412

$0.082

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Vyrian

USA . 8,071 parts In-Stock

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8,071

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VNN

France . 749 parts In-Stock

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749

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,706 parts In-Stock

1+ parts

$0.073

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-

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11,706

$0.073

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Corphita

USA . 773 parts In-Stock

1+ parts

$0.077

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773

$0.077

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Aztec Data Supply Inc.

USA . 3,527 parts In-Stock

1+ parts

$0.360

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3,527

$0.360

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Modulus Dynamics

Lithuania . 9,662 parts In-Stock

1+ parts

$1.398

100+ parts

$1.342

1k+ parts

$1.286

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-

9,662

$1.398

$1.342

$1.286

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Corohmni

South Africa . 976 parts In-Stock

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$1.564

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976

$1.564

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AZTECH Wire

Italy . 139 parts In-Stock

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$8.750

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139

$8.750

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Perfect Parts

USA . 3,658 parts In-Stock

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Argo Parts USA

USA . 3,179 parts In-Stock

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Continental Prestige Electronics

USA . 2,975 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock the power of cutting-edge technology with the BF2030E6814HTSA1 by Infineon Technologies. This RF Small Signal Field Effect Transistor offers unparalleled quality and reliability, making it the perfect choice for amplifier applications. With a single configuration and dual gate operating mode, this transistor delivers impressive power gain and operates in the ultra-high frequency band. Designed with precision and expertise, this product guarantees top-notch performance and efficiency, providing customers with exceptional value and unmatched advantages in their projects and applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this FET lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and are therefore more efficient for amplification purposes.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes it easier to integrate into electronic systems.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in signal amplification tasks.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Minimum DS Breakdown Voltage: 10 V

With a minimum breakdown voltage of 10V, this FET can handle higher voltages, offering a wider range of applications.

Minimum Power Gain (Gp): 20 dB

The minimum power gain of 20dB indicates high amplification capability, making it suitable for boosting weak signals.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the PCB and better utilization of space.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and connection, ensuring reliable electrical contact.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual-gate, depletion mode operation offers enhanced control and performance characteristics in certain applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency operation, making it suitable for applications requiring high-speed signal processing.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit design and allows for different connection configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOSFET technology for improved performance, efficiency, and reliability in various applications.

Transistor Element Material: SILICON

Silicon material offers high reliability and performance in FETs, ensuring consistent operation over time.

Maximum Drain Current (ID): 0.04 A

With a maximum drain current of 0.04A, this FET can handle moderate power levels in amplification tasks.

Terminal Position: DUAL

The dual terminal position allows for versatile connectivity options, enabling different circuit configurations.

Case Connection: SOURCE

Source connection enhances signal stability and noise immunity during operation, improving overall performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF2030E6814HTSA1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

10 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Minimum Power Gain (Gp):

20 dB

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF2030E6814HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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