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BF2030WE6327

Infineon Technologies

BF2030WE6327 by Infineon Technologies

BF2030WE6327 by Infineon Technologies is an N-CHANNEL RF FET with 10V DS Breakdown Voltage, 20dB Power Gain, and 0.2W Power Dissipation. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND due to DUAL GATE, DEPLETION MODE operation. Package: PLASTIC/EPOXY, Surface Mountable with GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 4,780 parts In-Stock

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4,780

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ACDS - Activité Composants Distribution Service

France . 2,532 parts In-Stock

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2,532

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Bristol Electronics

USA . 2,532 parts In-Stock

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2,532

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Dan-Mar Components

USA . 2,532 parts In-Stock

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2,532

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Vyrian

USA . 604 parts In-Stock

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604

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Digiode

USA . 524 parts In-Stock

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524

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 208 parts In-Stock

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$0.830

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208

$0.830

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Modulus Dynamics

Lithuania . 8,698 parts In-Stock

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$1.567

100+ parts

$1.504

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$1.442

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8,698

$1.567

$1.504

$1.442

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Corohmni

South Africa . 57 parts In-Stock

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$1.760

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57

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AZTECH Wire

Italy . 604 parts In-Stock

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$17.031

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604

$17.031

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Ampacity Inc.

Singapore . 1,314 parts In-Stock

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$45.050

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1,314

$45.050

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Semicontronic

India . 1,321 parts In-Stock

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$54.050

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$52.699

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$52.428

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1,321

$54.050

$52.699

$52.428

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,685 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,723 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Corphita

USA . 327 parts In-Stock

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327

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Argo Parts USA

USA . 242 parts In-Stock

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Continental Prestige Electronics

USA . 109 parts In-Stock

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Overview

The BF2030WE6327 by Infineon Technologies is a top-of-the-line RF Small Signal Field Effect Transistor that delivers exceptional performance and reliability. With a single configuration, ultra-high frequency band, and dual gate operation, this transistor is perfect for amplifier applications. Its plastic/epoxy package body ensures durability while the N-channel design offers versatility. Experience superior power gain and breakthrough technology with the BF2030WE6327, setting new standards in the industry. Elevate your projects with this high-quality component from a trusted manufacturer like Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good thermal conductivity and insulation, making the transistor reliable and efficient.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and efficiency compared to P-channel transistors, making them a preferred choice for many applications.

Minimum DS Breakdown Voltage: 10 V

With a minimum breakdown voltage of 10V, this transistor can handle higher voltages, ensuring stability and reliability in operation.

Minimum Power Gain (Gp): 20 dB

A minimum power gain of 20 dB indicates that this transistor can amplify signals effectively, making it suitable for amplifier applications.

Surface Mount: YES

Surface mount technology makes installation easier and reduces the footprint of the component, making it suitable for compact electronic devices.

Maximum Power Dissipation (Abs): 0.2 W

With a maximum power dissipation of 0.2W, this transistor can handle high power levels without overheating, ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this transistor a durable and efficient choice.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high temperatures, making it suitable for various environments.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF2030WE6327 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

10 V

Maximum Drain Current (Abs) (ID):

.04 A

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

20 dB

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF2030WE6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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