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3N203

Texas Instruments

3N203 by Texas Instruments

3N203 by Texas Instruments is a N-CHANNEL FET with 25V DS Breakdown Voltage, 20dB Power Gain, and 0.05A Drain Current. Ideal for AMPLIFIER applications in VERY HIGH FREQUENCY BAND due to DUAL GATE configuration and DEPLETION MODE operation. Package: METAL ROUND shape with WIRE terminals, suitable for high-temp environments up to 200°C.

Median Price

$17.935

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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DigiKey

USA . 50 parts In-Stock

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American Microsemiconductor Inc.

USA . 2,976 parts In-Stock

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$17.150

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Bristol Electronics

USA . 38 parts In-Stock

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$18.720

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$17.999

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Vyrian

USA . 7,721 parts In-Stock

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Digiode

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R&J Components

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DigiKey Marketplace

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Lakeland Logistics Inc

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Prism Electronics

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LittleDiode

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Huijzer Components

Netherlands . 7 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Holdelec - ElecDif-Pro

France . 4 parts In-Stock

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PC Components Company LLC

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ECAB

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Parana Technologies

USA . 31 parts In-Stock

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$0.699

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$1.735

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$1.735

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DigiPath Technology Company

USA . 2,110 parts In-Stock

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$0.769

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$0.708

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ChromeModa Solutions

Germany . 5,458 parts In-Stock

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$0.785

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$0.644

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$0.785

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IDEA Electronic Components Group

UK . 679 parts In-Stock

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$0.785

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$0.706

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Microchip USA

USA . 9,500 parts In-Stock

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$42.000

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$41.400

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$41.100

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$40.800

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$40.800

QUARKTWIN TECHNOLOGY LTD

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Corphita

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Native Components

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Northwest PG Solutions

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Metaverse IC Inc.

Canada . 370 parts In-Stock

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Kepictronics

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Assy Fe

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Perfect Parts

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RTC Component Inc.

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Overview

Step up your RF game with the 3N203 by Texas Instruments. Crafted with precision and expertise, this N-channel FET offers unrivaled performance in amplifier applications within the very high frequency band. With a minimum DS breakdown voltage of 25V and a power gain of 20dB, this transistor ensures top-notch quality and reliability. Whether you're a seasoned pro or just starting out, the 3N203 guarantees exceptional value, delivering superior results that will elevate your projects to new heights. Say goodbye to subpar performance and hello to excellence with the 3N203.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and efficient heat dissipation, ensuring the transistor can operate reliably even under high temperatures.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics and lower on-resistance compared to P-channel FETs, making them ideal for high-frequency applications.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages without breakdown, making it suitable for a wide range of amplifier applications.

Minimum Power Gain (Gp): 20 dB

A minimum power gain of 20 dB indicates strong amplification capabilities, making this transistor suitable for applications where signal amplification is crucial.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor is optimized for signal amplification and low noise performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low power consumption, making this transistor an efficient choice for RF signal processing.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature of 200°C, this transistor can withstand elevated temperatures and operate reliably in demanding environments.

Maximum Drain Current (ID): 0.05 A

With a maximum drain current of 0.05 A, this transistor can handle moderate current levels, making it suitable for various amplifier and signal processing applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 3N203 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Texas Instruments

Specs

Case Connection:

SOURCE AND SUBSTRATE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

.05 A

Maximum Drain Current (ID):

.05 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.03 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-72

JESD-30 Code:

O-MBCY-W4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

20 dB

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

3N203 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-036-8405, 5961010368405

NIIN

010368405

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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