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J308ZL1

Onsemi

J308ZL1 by Onsemi

J308ZL1 by Onsemi is an N-CHANNEL RF FET with 25V DS breakdown voltage, ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. Featuring a SINGLE configuration, it has a Crss of 2.5 pF and comes in a CYLINDRICAL package with TIN LEAD finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,912 parts In-Stock

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Vyrian

USA . 382 parts In-Stock

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TANS Electronics

Latvia . 6,243 parts In-Stock

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Problanco Electronics

Mexico . 2,915 parts In-Stock

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Kulean Microsystems

USA . 2,246 parts In-Stock

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SupplyDigital Components

Austria . 945 parts In-Stock

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UHIMA Technologies

Türkiye . 635 parts In-Stock

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Corphita

USA . 586 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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Overview

Boost your amplifier performance with the J308ZL1 by Onsemi. As a leading manufacturer in RF small signal FETs, Onsemi delivers top-quality products that excel in ultra-high frequency bands. The N-channel configuration ensures optimal signal amplification, while the depletion mode operation guarantees efficiency. With a minimum breakdown voltage of 25V and low feedback capacitance, this transistor offers unmatched reliability and precision in a compact cylindrical package. Upgrade your system today with the J308ZL1 for superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package provides good insulation and protection for the transistor, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FET typically has higher electron mobility, making it suitable for high-frequency applications such as amplifiers.

Configuration: SINGLE

Single configuration makes it easy to use and integrate into circuit designs, simplifying the overall circuit layout.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in amplifying signals.

Minimum DS Breakdown Voltage: 25 V

Suitable for applications where a higher breakdown voltage is required, providing added reliability and safety margin.

Package Shape: ROUND

The round package shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections for improved conductivity and durability.

Operating Mode: DEPLETION MODE

Depletion mode operation offers better control over the transistor characteristics, enhancing performance in certain applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high-frequency applications, making it suitable for high-speed signal processing and communication systems.

No. of Terminals: 3

Having 3 terminals allows for easy interfacing and connection with other circuit components, enabling versatile usage in different circuit designs.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact and space-efficient design, ideal for applications with limited space constraints.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high gain and low noise characteristics, making it suitable for amplifier and signal processing applications.

Transistor Element Material: SILICON

Silicon material provides good thermal properties and reliability, ensuring stable performance over a wide temperature range.

Terminal Finish: TIN LEAD

Tin lead finish on terminals offers good solderability and corrosion resistance, ensuring reliable connections and long-term durability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and soldering, facilitating efficient assembly and maintenance.

Maximum Feedback Capacitance (Crss): 2.5 pF

Low feedback capacitance helps in reducing signal distortion and improving overall amplifier performance, especially at higher frequencies.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) J308ZL1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

J308ZL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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