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BF998-TAPE-7

NXP Semiconductors

BF998-TAPE-7 by NXP Semiconductors

BF998-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 12V min DS breakdown voltage, operates in the ultra-high frequency band, and supports dual gate depletion mode. This compact surface mount transistor ensures reliable performance up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 1,917 parts In-Stock

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Digiode

USA . 1,592 parts In-Stock

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Vyrian

USA . 626 parts In-Stock

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One Stop Electronics

USA . 1,134 parts In-Stock

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$15.050

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$15.050

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UNI Independent Distributors

Spain . 6,864 parts In-Stock

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Corphita

USA . 2,124 parts In-Stock

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Northwest PG Solutions

USA . 1,490 parts In-Stock

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Native Components

USA . 353 parts In-Stock

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$3.789

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Overview

Unlock the potential of your designs with the BF998-TAPE-7 by NXP Semiconductors, a standout in RF Small Signal FETs. Renowned for their commitment to quality and innovation, NXP delivers this superior single-channel transistor ideal for amplifying signals at ultra-high frequencies. Its compact surface mount design ensures seamless integration into your projects, enhancing performance while maximizing efficiency. Elevate your applications with reliability you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and protection against environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance, resulting in better efficiency for amplification and switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection against reverse voltage, enhancing reliability in circuit designs.

Transistor Application: AMPLIFIER

Designed specifically for amplifying signals, this FET is ideal for audio and RF amplification applications.

Surface Mount: YES

Surface mount design allows for automated assembly processes and compact PCB layouts, facilitating space-saving designs.

Minimum DS Breakdown Voltage: 12 V

A minimum breakdown voltage of 12 V ensures robust performance in circuits that might experience higher voltage conditions.

Package Shape: RECTANGULAR

The rectangular shape optimizes space and layout when mounting on circuit boards.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and improve mechanical reliability in surface-mounted applications.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate capability offers enhanced control over the device's characteristics, ideal for precision applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ultra high-frequency capability allows this FET to be used in a variety of RF applications, making it versatile and effective in modern communication systems.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit design and allows for more complex configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the footprint on PCBs, allowing for more compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, making this FET efficient for signal processing.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability and stability in high-temperature environments.

Transistor Element Material: SILICON

Silicon offers high performance and stability, making it a proven material choice for reliable FET operation.

Maximum Drain Current (ID): 0.03 A

A maximum drain current of 30mA is suitable for low to moderate power applications, making this FET versatile for various project needs.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit layouts and integration, making it easier to work into existing designs.

Case Connection: SOURCE

Connecting the source to the case helps in reducing parasitic capacitance, improving device performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF998-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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