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J308RL

Onsemi

J308RL by Onsemi

J308RL by Onsemi is an N-CHANNEL RF FET with a 25V DS Breakdown Voltage. Ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND, it features a SINGLE configuration and operates in DEPLETION MODE. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

Median Price

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Lifecycle Status

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2

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1k+

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Digiode

USA . 1,032 parts In-Stock

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Vyrian

USA . 565 parts In-Stock

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TANS Electronics

Latvia . 5,495 parts In-Stock

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Problanco Electronics

Mexico . 4,274 parts In-Stock

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Corphita

USA . 1,267 parts In-Stock

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Kulean Microsystems

USA . 911 parts In-Stock

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UHIMA Technologies

Türkiye . 881 parts In-Stock

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Corohmni

South Africa . 391 parts In-Stock

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SupplyDigital Components

Austria . 121 parts In-Stock

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Overview

Enhance your amplification capabilities with the J308RL RF Small Signal Field Effect Transistor by Onsemi. Known for their superior quality and reliability, Onsemi's products are trusted by professionals worldwide. The J308RL is perfect for a variety of applications in the ultra-high frequency band, offering unparalleled performance and efficiency. Upgrade your amplifier circuits with this N-channel transistor and experience the difference in power and precision. Elevate your projects with Onsemi's cutting-edge technology and unlock new possibilities in RF signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ensuring easy handling and long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher mobility and efficiency compared to P-channel transistors, making them suitable for high-performance applications.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, making it easier to implement in various amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor can provide high gain and low noise performance in audio or RF circuits.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages and provide greater safety margin in amplifier circuits.

Package Shape: ROUND

The round package shape allows for easy mounting and integration into circuit boards, ideal for compact amplifier designs.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer secure connections and ease of soldering, ensuring reliable performance in amplifier applications.

Operating Mode: DEPLETION MODE

The depletion mode operation allows for easy biasing and control, making it a versatile choice for various amplifier circuit configurations.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, this transistor can provide reliable performance in high-speed amplifier circuits.

No. of Terminals: 3

With 3 terminals, this transistor can be easily integrated into amplifier circuits, offering flexibility in connectivity and control.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers space-saving and efficient heat dissipation properties, ideal for amplifier applications with limited space.

Field Effect Transistor Technology: JUNCTION

The junction FET technology offers high input impedance and low power consumption, making it a suitable choice for amplifier applications.

Transistor Element Material: SILICON

Silicon-based transistors provide reliable performance, high efficiency, and low cost, making them a popular choice for amplifier circuits.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and corrosion resistance, ensuring reliable connections in amplifier circuits.

Terminal Position: BOTTOM

The bottom terminal position allows for easy mounting and heat dissipation, contributing to the overall reliability and performance of the transistor.

Maximum Feedback Capacitance (Crss): 2.5 pF

With a low feedback capacitance of 2.5pF, this transistor can provide stable and high-frequency performance in amplifier circuits, reducing the risk of oscillation.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) J308RL attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

J308RL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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