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BF245ARLRP

Onsemi

BF245ARLRP by Onsemi

BF245ARLRP by Onsemi is an N-CHANNEL FET with 30V DS Breakdown Voltage. It operates in DEPLETION MODE for AMPLIFIER applications at ULTRA HIGH FREQUENCY BAND. This THROUGH-HOLE transistor has a max ID of 0.1A and comes in a CYLINDRICAL package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,265 parts In-Stock

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Vyrian

USA . 629 parts In-Stock

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Kulean Microsystems

USA . 6,155 parts In-Stock

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Problanco Electronics

Mexico . 5,600 parts In-Stock

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SupplyDigital Components

Austria . 4,128 parts In-Stock

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Corphita

USA . 2,264 parts In-Stock

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TANS Electronics

Latvia . 2,212 parts In-Stock

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Northwest PG Solutions

USA . 1,420 parts In-Stock

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Native Components

USA . 808 parts In-Stock

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808

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Corohmni

South Africa . 473 parts In-Stock

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UHIMA Technologies

Türkiye . 448 parts In-Stock

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Overview

Upgrade your RF signal amplification with the BF245ARLRP by Onsemi, a high-quality N-CHANNEL field effect transistor designed for ultra high frequency band applications. Manufactured by Onsemi, a trusted name in semiconductor technology, this transistor offers exceptional performance and reliability. Whether you're looking to enhance your amplifier circuits or improve signal reception, the BF245ARLRP delivers unmatched value and benefits. Trust Onsemi for superior quality and take your RF projects to the next level with this cutting-edge component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the transistor lightweight and durable, making it easy to handle and suitable for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel type ensures efficient electron flow, allowing for high performance and reliability in amplifier applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and installation process, making it user-friendly and convenient for integration in different systems.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages without risking damage, ensuring long-term stability and reliability.

Package Shape: ROUND

The round package shape allows for easy installation and provides mechanical stability, which is essential for maintaining the transistor's performance under various operating conditions.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure connections and ease of soldering, ensuring a reliable electrical connection in the circuit.

Operating Mode: DEPLETION MODE

The depletion mode operation allows for precise control over the transistor's conductivity, enabling efficient amplification and signal processing in amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The transistor's capability to operate in the ultra-high frequency band makes it suitable for high-speed signal processing, making it ideal for advanced communication and RF applications.

No. of Terminals: 3

The three terminals provide the necessary connections for amplification and signal processing, ensuring compatibility with various circuit configurations and applications.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers compact dimensions and efficient heat dissipation, making it suitable for space-constrained applications and high-power operation.

Field Effect Transistor Technology: JUNCTION

The junction field-effect transistor technology allows for high gain and low noise operation, ensuring optimal performance in amplifier circuits.

Transistor Element Material: SILICON

Silicon material provides excellent thermal stability and high electron mobility, enhancing the transistor's performance and reliability in various environmental conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and corrosion resistance, maintaining stable electrical connections over time in different operating environments.

Maximum Drain Current (ID): 0.1 A

The maximum drain current of 0.1A allows for efficient power handling and amplification capabilities, making the transistor suitable for low to medium power applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting and soldering, ensuring a secure and reliable connection for optimal performance in the circuit.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF245ARLRP attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF245ARLRP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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