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FGH30T65UPD_F155

Onsemi

FGH30T65UPD_F155 by Onsemi

FGH30T65UPD_F155 by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.3V and IC of 60A. Ideal for POWER CONTROL applications, it has a max VCE of 650V and can dissipate up to 250W. With fast turn-off time (toff) of 170ns, this RECTANGULAR transistor operates b/w -55 °C to 175°C.

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Vyrian

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Digiode

USA . 1,810 parts In-Stock

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Native Components

USA . 261 parts In-Stock

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$1.620

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Northwest PG Solutions

USA . 538 parts In-Stock

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Problanco Electronics

Mexico . 7,839 parts In-Stock

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SupplyDigital Components

Austria . 5,490 parts In-Stock

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Supply Digital

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Corphita

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TANS Electronics

Latvia . 1,215 parts In-Stock

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Kulean Microsystems

USA . 366 parts In-Stock

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Corohmni

South Africa . 212 parts In-Stock

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UHIMA Technologies

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Overview

Unleash the power of the FGH30T65UPD_F155 by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor designed to revolutionize power control applications. Manufactured with precision and expertise by Onsemi, this N-CHANNEL transistor offers unrivaled quality and reliability in a sleek RECTANGULAR package. Whether you're looking to enhance your power systems or optimize energy efficiency, this single transistor with built-in diode is the perfect solution. With a maximum Collector-Emitter Voltage of 650V and a Maximum Collector Current of 60A, the FGH30T65UPD_F155 delivers exceptional performance and durability. Upgrade your power control applications today and experience the superior value and benefits that Onsemi's IGBT technology has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability and performance.

Polarity or Channel Type: N-CHANNEL

Offers high efficiency and low on-resistance, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, providing efficient and reliable control over power flow.

Maximum VCEsat: 2.3 V

Low VCEsat minimizes power loss and helps improve overall efficiency of the transistor.

Package Shape: RECTANGULAR

Facilitates easy mounting and installation in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Ensures secure connections and easy soldering during PCB assembly.

Nominal Turn Off Time (toff): 170 ns

Fast turn off time allows for quick switching and efficient operation in power control applications.

No. of Terminals: 3

Simplifies circuit connections and provides essential connections for effective power control.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability allows for handling of high power levels without overheating.

Package Style (Meter): FLANGE MOUNT

Enables secure mounting and easy integration into various electronic systems.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High breakdown voltage enables the transistor to handle high voltage applications with ease.

Transistor Element Material: SILICON

Silicon material offers high reliability, efficiency, and performance for power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures stable operation and protection against voltage spikes.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold conditions without compromising performance.

Maximum Collector Current (IC): 60 A

High collector current rating enables the transistor to handle high current loads efficiently.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

Low threshold voltage facilitates easy gate control and efficient switching of the transistor.

Terminal Position: SINGLE

Simplified terminal layout for easy connection and integration in electronic circuits.

Case Connection: COLLECTOR

Collector connection for efficient power flow and control in power control applications.

Nominal Turn On Time (ton): 52 ns

Fast turn on time ensures quick response and efficient switching for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH30T65UPD_F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

170 ns

Nominal Turn On Time (ton):

52 ns

Maximum VCEsat:

2.3 V

Trade Compliance

FGH30T65UPD_F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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