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FGH30T65UPDT-F155

Onsemi

FGH30T65UPDT-F155 by Onsemi

FGH30T65UPDT-F155 by Onsemi is an N-CHANNEL IGBT with 650V max collector-emitter voltage and 60A max collector current. It has a built-in diode, 170ns turn-off time, and 250W power dissipation. Ideal for power control applications requiring high efficiency and reliability in a flange mount package.

Median Price

$1.569

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 74 parts In-Stock

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$1.569

100+ parts

$1.343

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$1.316

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74

$1.569

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Chip1Stop

Japan . 74 parts In-Stock

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$3.030

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$3.030

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Verical

USA . 74 parts In-Stock

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$1.343

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$1.316

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74

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$1.343

$1.316

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Distributors (In-Stock)

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Digiode

USA . 1,171 parts In-Stock

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$1.491

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Vyrian

USA . 8,769 parts In-Stock

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South Electronics

USA . 4,093 parts In-Stock

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Flip Electronics

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4,000

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Distributors (Availability)

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Native Components

USA . 755 parts In-Stock

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$0.363

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$0.349

755

$0.363

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$0.349

Northwest PG Solutions

USA . 461 parts In-Stock

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$0.400

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$0.352

461

$0.400

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$0.352

Corohmni

South Africa . 92 parts In-Stock

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$1.343

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92

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Corphita

USA . 2,367 parts In-Stock

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$1.412

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QUARKTWIN TECHNOLOGY LTD

USA . 15,843 parts In-Stock

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SupplyDigital Components

Austria . 8,392 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

USA . 3,429 parts In-Stock

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Supply Digital

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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TANS Electronics

Latvia . 726 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 265 parts In-Stock

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Overview

Unleash the power of the FGH30T65UPDT-F155 by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor that sets the standard in power control. With its high-quality construction and reliable performance, this N-CHANNEL transistor with built-in diode is perfect for a wide range of applications. From industrial machinery to renewable energy systems, this product delivers unparalleled efficiency and durability. Trust Onsemi's expertise and experience in semiconductor manufacturing to bring you cutting-edge technology that will elevate your projects to new heights. Experience the difference with the FGH30T65UPDT-F155 - your gateway to superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and protects the inner components of the transistor, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state resistance and higher efficiency compared to P-Channel IGBTs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps in protecting the transistor from voltage spikes during switching, enhancing the overall reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, providing high current and voltage handling capabilities with efficient power switching.

Maximum Gate-Emitter Voltage: 20 V

With a high maximum gate-emitter voltage, this IGBT can withstand higher gate drive voltages, making it suitable for robust and reliable operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH30T65UPDT-F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

170 ns

Nominal Turn On Time (ton):

52 ns

Trade Compliance

FGH30T65UPDT-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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