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DL-3147-021

Onsemi

DL-3147-021 by Onsemi

DL-3147-021 by Onsemi is a 660nm LASER DIODE with AlGaInP material. It operates b/w -10 °C to 40°C, suitable for THROUGH HOLE MOUNT applications. This diode offers precise peak wavelength emission for various optoelectronic uses.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,674 parts In-Stock

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Vyrian

USA . 1,412 parts In-Stock

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Native Components

USA . 193 parts In-Stock

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$5.550

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TANS Electronics

Latvia . 6,348 parts In-Stock

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Kulean Microsystems

USA . 5,698 parts In-Stock

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Problanco Electronics

Mexico . 5,173 parts In-Stock

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SupplyDigital Components

Austria . 1,635 parts In-Stock

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Corphita

USA . 1,079 parts In-Stock

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Northwest PG Solutions

USA . 692 parts In-Stock

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UHIMA Technologies

Türkiye . 302 parts In-Stock

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Corohmni

South Africa . 162 parts In-Stock

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Overview

Elevate your products with the DL-3147-021 Laser Diode by Onsemi. Manufactured with precision and quality, this laser diode offers peak performance at a wavelength of 660nm. Ideal for a variety of applications, from optical communication to industrial use, this laser diode provides unparalleled reliability and efficiency. Trust in Onsemi's expertise in optoelectronics to deliver cutting-edge technology that will enhance your product offerings. Experience the value and benefits of the DL-3147-021 and see the advantages it brings to your projects.

Feature Benefit Bullets

Peak Wavelength: 660nm

The specific peak wavelength of 660nm allows for precise targeting and accuracy in various applications, making it a reliable choice for laser diode technology.

Optoelectronic Type: LASER DIODE

Being a laser diode ensures efficient and focused light output, making it suitable for a wide range of optical and communication applications.

Maximum Operating Temperature: 40 °C

The high maximum operating temperature of 40 °C allows for stable performance even in challenging environmental conditions, increasing the reliability and longevity of the product.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10 °C ensures that the laser diode can function effectively in colder environments, giving it versatility in various usage scenarios.

Semiconductor Material: AlGaInP

The use of AlGaInP semiconductor material in the diode enhances its efficiency and power output, providing consistent and high-performance results in applications that require precision and reliability.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and ensures secure placement of the laser diode, facilitating ease of use and maintenance in different systems and setups.

Technical Specifications

Laser Diodes DL-3147-021 attributes and parameters. Explore more Laser Diodes devices from Onsemi

Specs

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-10 Cel

Optoelectronic Type:

Peak Wavelength (nm):

660

Semiconductor Material:

AlGaInP

Sub-Category:

Laser Diodes

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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