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D45VH10AN

Onsemi

D45VH10AN by Onsemi

D45VH10AN by Onsemi is a PNP BJT transistor with max. collector-emitter voltage of 80V, max. collector current of 15A, and min. DC current gain of 20. Ideal for switching applications, it operates at up to 150 °C and has a nominal transition frequency of 50MHz in a flange mount package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,780 parts In-Stock

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Digiode

USA . 1,538 parts In-Stock

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Native Components

USA . 332 parts In-Stock

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$1.366

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332

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Northwest PG Solutions

USA . 1,181 parts In-Stock

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$1.503

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Kulean Microsystems

USA . 7,669 parts In-Stock

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Problanco Electronics

Mexico . 6,897 parts In-Stock

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Corphita

USA . 2,162 parts In-Stock

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TANS Electronics

Latvia . 2,161 parts In-Stock

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Corohmni

South Africa . 365 parts In-Stock

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SupplyDigital Components

Austria . 226 parts In-Stock

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UHIMA Technologies

Türkiye . 63 parts In-Stock

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Overview

Unlock the power of precision with the D45VH10AN by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unmatched quality and reliability in their Power Bipolar Junction Transistors. Ideal for switching applications, this PNP transistor offers a seamless performance with a maximum collector-emitter voltage of 80V and a maximum collector current of 15A. Whether you're in need of a robust solution for industrial automation or energy-efficient designs, the D45VH10AN provides the value and reliability you can trust. Elevate your projects with Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-lasting performance.

Polarity or Channel Type: PNP

Suitable for applications requiring PNP transistors, providing compatibility with specific circuit requirements.

Configuration: SINGLE

Simplified setup and usage due to single configuration, making it easier to integrate into circuits.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring efficient and effective performance in such scenarios.

Package Shape: RECTANGULAR

Space-saving design with a rectangular shape, facilitating easy placement and mounting in compact spaces.

No. of Terminals: 3

Straightforward connectivity with 3 terminals, allowing for simple integration into circuitry.

Maximum Collector-Emitter Voltage: 80 V

Capable of handling high voltage levels, making it suitable for applications requiring such voltage ratings.

Maximum Collector Current (IC): 15 A

High collector current rating allows for handling of large currents, making it versatile for various applications.

Nominal Transition Frequency (fT): 50 MHz

High transition frequency ensures fast switching speeds, ideal for applications requiring quick response times.

Technical Specifications

Power Bipolar Junction Transistors (BJT) D45VH10AN attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

80 V

Configuration:

Minimum DC Current Gain (hFE):

20

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

D45VH10AN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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