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AMIS41683CANN1RG

Onsemi

AMIS41683CANN1RG by Onsemi

AMIS41683CANN1RG by Onsemi is a Network Interface with 14 terminals, operating at -40 to 125 °C. It has a supply voltage of 5V and current of 0.012mA, suitable for automotive applications. The package is small outline, surface mountable, with matte tin finish and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,945 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,308 parts In-Stock

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Digiode

USA . 1,125 parts In-Stock

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Native Components

USA . 66 parts In-Stock

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$9.500

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66

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Northwest PG Solutions

USA . 2,082 parts In-Stock

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$10.450

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$9.405

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AZTECH Wire

Italy . 349 parts In-Stock

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$18.690

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349

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QUARKTWIN TECHNOLOGY LTD

USA . 17,169 parts In-Stock

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Problanco Electronics

Mexico . 6,473 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,354 parts In-Stock

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TANS Electronics

Latvia . 4,251 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,236 parts In-Stock

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Kepictronics

USA . 2,422 parts In-Stock

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SupplyDigital Components

Austria . 2,030 parts In-Stock

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Corphita

USA . 1,469 parts In-Stock

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Kulean Microsystems

USA . 1,424 parts In-Stock

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Metaverse IC Inc.

Canada . 1,076 parts In-Stock

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Corohmni

South Africa . 408 parts In-Stock

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Microchip USA

USA . 290 parts In-Stock

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UHIMA Technologies

Türkiye . 257 parts In-Stock

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Overview

Enhance your network interfaces with the AMIS41683CANN1RG by Onsemi. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Ideal for automotive applications, this small outline package provides a seamless connection with its 14 terminals and dual terminal position. With a nominal supply voltage of 3.3V and a maximum operating temperature of 125 °C, this interface circuit ensures optimal performance in any environment. Trust Onsemi to deliver cutting-edge technology that maximizes efficiency and functionality. Elevate your network connectivity with the AMIS41683CANN1RG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight and durable design for the network interface.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, making it convenient for assembly and maintenance.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design that can fit seamlessly in various electronic devices.

Power Supplies (V): 5

With a power supply of 5V, this network interface can accommodate standard voltage requirements for efficient operation.

No. of Terminals: 14

Having 14 terminals allows for multiple connections, enabling versatile connectivity options for different devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enhances the overall aesthetic of the network interface.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the network interface to function effectively in a wide range of conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and promotes good solderability for secure connections.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in installation and allows for various connection configurations.

Maximum Seated Height: 1.7272 mm

The low maximum seated height allows for a slim profile, which can be beneficial for space-constrained applications.

Width: 3.937 mm

The narrow width of the network interface contributes to a compact and streamlined design.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature reduces the risk of component damage during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering of the network interface for reliable connections.

Length: 8.6868 mm

The moderate length of the network interface offers a balance between compactness and ease of handling during installation.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this network interface is suitable for use in automotive applications with varying temperature conditions.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures secure attachment to circuit boards.

Maximum Supply Current: 0.012 mA

The low maximum supply current helps in reducing energy consumption and heat generation, making the network interface energy-efficient.

Telecom IC Type: INTERFACE CIRCUIT

Being an interface circuit type designed for telecom applications, this network interface offers reliable communication capabilities for telecommunications equipment.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in electronic devices, ensuring compatibility with a wide range of systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides ample spacing between terminals for easy soldering and maintenance.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this network interface is less prone to moisture-related damage, ensuring long-term reliability.

Technical Specifications

Network Interfaces AMIS41683CANN1RG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.6868 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.012 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

AMIS41683CANN1RG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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