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2SK4085LS

Onsemi

2SK4085LS by Onsemi

2SK4085LS by Onsemi is a N-CHANNEL FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 60A IDM, 159mJ EAS, and 0.43 ohm RDS(on). Package style is FLANGE MOUNT with THROUGH-HOLE terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 69,000 parts In-Stock

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Digiode

USA . 1,361 parts In-Stock

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Vyrian

USA . 430 parts In-Stock

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430

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Prism Electronics

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100

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Component Stockers USA

USA . 501 parts In-Stock

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$99.990

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501

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 7,872 parts In-Stock

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Kulean Microsystems

USA . 3,925 parts In-Stock

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SupplyDigital Components

Austria . 3,649 parts In-Stock

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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TANS Electronics

Latvia . 2,296 parts In-Stock

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Northwest PG Solutions

USA . 2,097 parts In-Stock

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UHIMA Technologies

Türkiye . 576 parts In-Stock

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Corohmni

South Africa . 464 parts In-Stock

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Corphita

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Overview

Unlock the power of innovation with the 2SK4085LS by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in every product. The 2SK4085LS falls under the category of Power Field Effect Transistors (FET) and is designed for switching applications. With a minimum DS Breakdown Voltage of 500V and a maximum Drain Current of 16A, this transistor offers unmatched performance and efficiency. Whether you're looking to enhance your electronic projects or improve your industrial processes, the 2SK4085LS provides the value, benefits, and advantages that customers need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power applications due to their low ON-state resistance and high efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the transistor from voltage spikes and reverse currents, enhancing its reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can efficiently control the flow of current in electronic circuits.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this transistor can handle high voltage levels, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 60 A

The high pulsed drain current rating allows this transistor to handle short bursts of high current without damage.

Avalanche Energy Rating (EAS): 159 mJ

The high avalanche energy rating indicates that this transistor can withstand voltage spikes and surges effectively.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it ideal for power applications.

Maximum Drain Current (ID): 16 A

With a high drain current rating, this transistor can handle continuous current flow without overheating.

Maximum Drain-Source On Resistance: 0.43 ohm

The low on-resistance of this transistor reduces power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4085LS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

159 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.43 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2SK4085LS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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