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2SK4085LS-1E

Onsemi

2SK4085LS-1E by Onsemi

The Onsemi 2SK4085LS-1E is a N-channel Power FET with 500V DS breakdown voltage and 60A IDM. Ideal for applications requiring high power dissipation, such as inverter drives and power supplies. Features include single configuration with built-in diode, rectangular package shape, and operating temperature up to 150 °C.

Median Price

$1.363

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 136,773 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.090

10k+ parts

$1.020

136,773

-

$1.220

$1.090

$1.020

DigiKey

USA . 136,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.600

10k+ parts

-

136,773

-

-

$1.600

-

Verical

USA . 83,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.363

10k+ parts

$1.275

83,850

-

-

$1.363

$1.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,237 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

-

1,237

$1.120

-

-

-

Digiode

USA . 727 parts In-Stock

1+ parts

$1.282

100+ parts

-

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-

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727

$1.282

-

-

-

DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 137 parts In-Stock

1+ parts

$1.120

100+ parts

-

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137

$1.120

-

-

-

Corphita

USA . 1,140 parts In-Stock

1+ parts

$1.215

100+ parts

-

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1,140

$1.215

-

-

-

Microchip USA

USA . 118 parts In-Stock

1+ parts

$8.450

100+ parts

-

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118

$8.450

-

-

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Native Components

USA . 151 parts In-Stock

1+ parts

$23.580

100+ parts

-

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151

$23.580

-

-

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Northwest PG Solutions

USA . 1,250 parts In-Stock

1+ parts

$25.938

100+ parts

$23.344

1k+ parts

-

10k+ parts

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1,250

$25.938

$23.344

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Problanco Electronics

Mexico . 7,606 parts In-Stock

1+ parts

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7,606

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TANS Electronics

Latvia . 6,689 parts In-Stock

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6,689

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Kulean Microsystems

USA . 6,608 parts In-Stock

1+ parts

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6,608

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SupplyDigital Components

Austria . 5,617 parts In-Stock

1+ parts

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5,617

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$1.120

1k+ parts

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1,000

-

$1.120

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UHIMA Technologies

Türkiye . 754 parts In-Stock

1+ parts

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754

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Overview

Unleash the power of innovation with the 2SK4085LS-1E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. This Power Field Effect Transistor (FET) is perfect for a wide range of applications, offering customers superior performance and efficiency. With its single configuration and built-in diode, this transistor provides unmatched value and benefits to users. Trust Onsemi to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the FET resistant to physical damage and environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making this product suitable for high-performance applications.

Minimum DS Breakdown Voltage: 500 V

High breakdown voltage allows the FET to handle high voltages and provide reliable performance in demanding situations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and more efficient than depletion mode FETs, ensuring optimal performance in various applications.

Maximum Pulsed Drain Current (IDM): 60 A

High pulsed drain current capability enables the FET to handle sudden spikes in current without damage, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 40 W

With a high power dissipation rating, this FET can handle heat efficiently, ensuring stable operation even under high load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability, making this FET a good choice for critical applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without performance degradation, ensuring long-term reliability.

Maximum Drain-Source On Resistance: 0.43 ohm

Low on-resistance helps minimize power loss and heat generation, making this FET energy-efficient and suitable for high-efficiency applications.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4085LS-1E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

141 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.43 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

2SK4085LS-1E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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