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2SK4086LS

Onsemi

2SK4086LS by Onsemi

The Onsemi 2SK4086LS is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a max IDM of 43A and EAS of 79mJ, suitable for SWITCHING applications. The transistor features a SINGLE configuration with BUILT-IN DIODE, operating in ENHANCEMENT MODE.

Median Price

$0.423

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$0.423

1k+ parts

$0.351

10k+ parts

$0.313

30

-

$0.423

$0.351

$0.313

Distributors (In-Stock)

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Digiode

USA . 473 parts In-Stock

1+ parts

$0.330

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473

$0.330

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Vyrian

USA . 2,728 parts In-Stock

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2,728

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Corphita

USA . 1,695 parts In-Stock

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$0.312

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$0.312

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Corohmni

South Africa . 465 parts In-Stock

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$0.347

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465

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Kepictronics

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,306 parts In-Stock

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SupplyDigital Components

Austria . 7,303 parts In-Stock

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Problanco Electronics

Mexico . 5,101 parts In-Stock

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UHIMA Technologies

Türkiye . 896 parts In-Stock

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Northwest PG Solutions

USA . 669 parts In-Stock

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Kulean Microsystems

USA . 270 parts In-Stock

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Native Components

USA . 248 parts In-Stock

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Perfect Parts

USA . 123 parts In-Stock

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GreenTree Electronics

Israel . 80 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 15 parts In-Stock

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Overview

Unlock the power of innovation with the 2SK4086LS by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a minimum DS Breakdown Voltage of 600V and a maximum Drain Current of 11.5A, this N-CHANNEL transistor provides exceptional performance and reliability. Its enhanced design ensures efficiency and durability, making it ideal for a wide range of electronic devices. Discover the value and benefits of the 2SK4086LS and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the transistor more reliable and long-lasting.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency by allowing for faster and more controlled switching.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows for use in high voltage applications, providing safety and reliability in demanding environments.

Maximum Pulsed Drain Current (IDM): 43 A

Capable of handling high peak currents, making it suitable for applications where high power output is required.

Avalanche Energy Rating (EAS): 79 mJ

Can withstand high energy spikes and transients, ensuring protection against voltage surges and overloads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance, low power consumption, and minimal heat dissipation, making it ideal for efficient power management.

Maximum Drain Current (ID): 11.5 A

Capable of carrying high continuous currents, suitable for applications requiring sustained power output.

Maximum Drain-Source On Resistance: 0.75 ohm

Low on-resistance minimizes power losses and heat dissipation, improving overall efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4086LS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

79 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

11.5 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

43 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2SK4086LS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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