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2SK4067(TP)

Onsemi

2SK4067(TP) by Onsemi

2SK4067(TP) by Onsemi is a N-CHANNEL FET with 8A ID and 10W power dissipation. Ideal for applications requiring high drain current like power supplies, motor control, and LED lighting due to its single configuration and enhancement mode operation at up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,349 parts In-Stock

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1,349

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Vyrian

USA . 1,263 parts In-Stock

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1,263

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Distributors (Availability)

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Native Components

USA . 22 parts In-Stock

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$0.354

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$0.339

22

$0.354

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$0.339

Northwest PG Solutions

USA . 249 parts In-Stock

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$0.389

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$0.343

249

$0.389

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$0.343

SupplyDigital Components

Austria . 3,883 parts In-Stock

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3,883

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Kulean Microsystems

USA . 3,856 parts In-Stock

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3,856

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Problanco Electronics

Mexico . 2,318 parts In-Stock

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2,318

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Corphita

USA . 1,347 parts In-Stock

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UHIMA Technologies

Türkiye . 444 parts In-Stock

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TANS Electronics

Latvia . 296 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Overview

Elevate your power management solutions with the 2SK4067(TP) by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like no other. With N-CHANNEL polarity and ENHANCEMENT MODE operating mode, this single configuration transistor offers a maximum drain current of 8A and a power dissipation of 10W. Ideal for various applications, this METAL-OXIDE SEMICONDUCTOR technology ensures reliable performance even at temperatures up to 150 °C. Trust Onsemi to provide you with the value, benefits, and advantages you need for your next project. Choose the 2SK4067(TP) and power up with confidence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used for higher power applications due to their lower ON resistance and superior performance.

Configuration: SINGLE

Single configuration allows for simple circuit design and ease of use.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and high efficiency in power applications.

Maximum Drain Current (ID): 8 A

With a high maximum drain current rating of 8A, this FET can handle heavy load currents effectively.

Maximum Power Dissipation: 10 W

The high maximum power dissipation of 10W ensures reliable operation and prevents overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and superior performance in power applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperature environments and ensure stable performance.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4067(TP) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

2SK4067(TP) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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