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2SK4066(SMP)

Onsemi

2SK4066(SMP) by Onsemi

The Onsemi 2SK4066(SMP) is a N-CHANNEL Power FET with 100A max drain current and 90W max power dissipation. It operates in enhancement mode with a max temperature of 150 °C. Ideal for high-power applications requiring efficient switching and control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,785 parts In-Stock

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Digiode

USA . 1,072 parts In-Stock

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1,072

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 223 parts In-Stock

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$21.380

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223

$21.380

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Northwest PG Solutions

USA . 1,167 parts In-Stock

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$23.518

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$21.166

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1,167

$23.518

$21.166

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SupplyDigital Components

Austria . 7,856 parts In-Stock

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7,856

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Problanco Electronics

Mexico . 6,486 parts In-Stock

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6,486

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Kulean Microsystems

USA . 6,362 parts In-Stock

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6,362

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TANS Electronics

Latvia . 5,968 parts In-Stock

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5,968

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Corphita

USA . 2,111 parts In-Stock

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2,111

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UHIMA Technologies

Türkiye . 603 parts In-Stock

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Corohmni

South Africa . 268 parts In-Stock

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Overview

Experience the power of innovation with the 2SK4066(SMP) by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that guarantee reliability and performance. Ideal for a variety of applications, this N-CHANNEL transistor offers unmatched efficiency and durability. With a maximum drain current of 100A and power dissipation of 90W, the 2SK4066(SMP) is designed to exceed expectations. Trust Onsemi to provide you with cutting-edge technology that will elevate your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their low on-resistance and high current-carrying capacity.

Configuration: SINGLE

SINGLE configuration FETs are easier to design and control in circuits compared to multiple configurations, making them more user-friendly.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs are normally-off devices, providing better control and safety in power circuits.

Maximum Drain Current (Abs) (ID): 100 A

With a high maximum drain current of 100 A, this FET can handle heavy loads efficiently without overheating.

Maximum Power Dissipation (Abs): 90 W

The maximum power dissipation of 90 W ensures that the FET can operate reliably under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers high efficiency and reliability in power applications.

Maximum Operating Temperature: 150 °C

The FET can handle high temperatures up to 150 °C, making it suitable for a wide range of operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4066(SMP) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

2SK4066(SMP) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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