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2SK4065-DL-E

Onsemi

2SK4065-DL-E by Onsemi

The Onsemi 2SK4065-DL-E is a N-CHANNEL Power FET with 100A max drain current and 90W max power dissipation. Ideal for applications requiring high power handling in enhancement mode operation, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 45,000 parts In-Stock

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Vyrian

USA . 7,177 parts In-Stock

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Digiode

USA . 1,821 parts In-Stock

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Flip Electronics

USA . 1,000 parts In-Stock

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Native Components

USA . 316 parts In-Stock

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$15.230

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Northwest PG Solutions

USA . 1,003 parts In-Stock

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$16.753

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$15.078

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AZTECH Wire

Italy . 1,029 parts In-Stock

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$18.260

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SupplyDigital Components

Austria . 5,305 parts In-Stock

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Problanco Electronics

Mexico . 4,327 parts In-Stock

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Perfect Parts

USA . 3,853 parts In-Stock

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Kulean Microsystems

USA . 2,331 parts In-Stock

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TANS Electronics

Latvia . 1,991 parts In-Stock

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Corohmni

South Africa . 447 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 199 parts In-Stock

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Overview

Unlock the power of innovation with the 2SK4065-DL-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are essential for a wide range of applications. With its N-CHANNEL configuration and ENHANCEMENT MODE operation, this FET offers exceptional performance with a maximum Drain Current of 100 A and Power Dissipation of 90 W. Experience the reliability and efficiency of Onsemi's cutting-edge technology, designed to exceed expectations in every aspect. Elevate your projects with the 2SK4065-DL-E and discover the endless possibilities it brings to your work.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs tend to have lower on-state resistance, making them more efficient for high-power applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly, saving space and time in manufacturing.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation and can be easily turned on and off, making them suitable for various applications.

Maximum Drain Current (Abs) (ID): 100 A

With a high maximum drain current, this FET can handle large amounts of current without overheating, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 90 W

The high maximum power dissipation allows the FET to handle significant power without getting damaged, ensuring reliability in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low input capacitance and high switching speeds, making the FET suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, increasing its reliability in harsh environments.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and oxidation resistance, ensuring reliable connections and longevity of the component.

Maximum Drain Current (ID): 100 A

Reiterating the high maximum drain current of 100 A, highlighting the FET's capability to handle heavy current loads.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4065-DL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

2SK4065-DL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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