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2SK4074LS

Onsemi

2SK4074LS by Onsemi

The Onsemi 2SK4074LS is a N-CHANNEL Power FET with 76A max drain current and 40W power dissipation. Ideal for applications requiring high power handling in enhancement mode operation, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

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2

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< 1k

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Digiode

USA . 593 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 7,811 parts In-Stock

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TANS Electronics

Latvia . 3,551 parts In-Stock

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Problanco Electronics

Mexico . 2,549 parts In-Stock

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Northwest PG Solutions

USA . 1,972 parts In-Stock

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Corphita

USA . 1,411 parts In-Stock

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Native Components

USA . 912 parts In-Stock

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UHIMA Technologies

Türkiye . 601 parts In-Stock

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Corohmni

South Africa . 455 parts In-Stock

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Kulean Microsystems

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Overview

Power up your projects with the 2SK4074LS N-CHANNEL Power Field Effect Transistor by Onsemi. With a maximum drain current of 76 A and a power dissipation of 40 W, this transistor offers reliable performance and efficiency for a wide range of applications. Whether you're in the automotive industry, power management, or industrial control, this Enhancement Mode FET is built to deliver top-notch quality and value. Trust Onsemi's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and low resistance, making them suitable for high power applications.

Configuration: SINGLE

Single configuration FETs are easy to install and manage, making them a reliable choice for power control applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low output impedance, providing efficient power switching capabilities.

Maximum Drain Current (Abs) (ID): 76 A

High maximum drain current capability allows for handling larger loads and ensures robust performance in various applications.

Maximum Power Dissipation (Abs): 40 W

The high maximum power dissipation rating ensures that the FET can handle power spikes and continuous operation without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability, low gate leakage, and improved performance, making it ideal for power switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature tolerance ensures reliable operation in harsh environments and high-temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4074LS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

2SK4074LS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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