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2SK4067(TP-FA)

Onsemi

2SK4067(TP-FA) by Onsemi

Onsemi's 2SK4067(TP-FA) is a N-CHANNEL Power FET with 8A max drain current and 10W power dissipation. Ideal for applications requiring high power handling in enhancement mode operation, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,257 parts In-Stock

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2,257

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Vyrian

USA . 1,538 parts In-Stock

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1,538

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Distributors (Availability)

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Native Components

USA . 38 parts In-Stock

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$0.695

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38

$0.695

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Northwest PG Solutions

USA . 2,164 parts In-Stock

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$0.764

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2,164

$0.764

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Problanco Electronics

Mexico . 6,617 parts In-Stock

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6,617

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Kulean Microsystems

USA . 6,089 parts In-Stock

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6,089

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SupplyDigital Components

Austria . 5,479 parts In-Stock

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5,479

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TANS Electronics

Latvia . 1,930 parts In-Stock

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1,930

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Corphita

USA . 1,347 parts In-Stock

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1,347

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Corohmni

South Africa . 391 parts In-Stock

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391

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UHIMA Technologies

Türkiye . 41 parts In-Stock

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41

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Overview

Unleash the power of innovation with the 2SK4067(TP-FA) by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). With applications ranging from power supplies to motor control, this N-CHANNEL transistor offers enhanced performance and efficiency. Experience the value and benefits of this product as it provides maximum drain current, high power dissipation, and operates at an impressive temperature range. Elevate your projects with the 2SK4067(TP-FA) and witness the difference in performance it brings.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for high efficiency and fast switching speeds, making this product suitable for applications requiring high performance.

Configuration: SINGLE

The single configuration simplifies the design and installation process, reducing the chances of errors and ensuring a more reliable operation.

Surface Mount: YES

Surface mount technology allows for compact and space-saving PCB designs, ideal for applications with limited space or requiring a low profile.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation and improved efficiency, making this product suitable for high-performance applications.

Maximum Drain Current (Abs) (ID): 8 A

With a high maximum drain current rating of 8 A, this FET can handle demanding load requirements, ensuring reliable operation under heavy loads.

Maximum Power Dissipation (Abs): 10 W

The high maximum power dissipation rating of 10 W allows for efficient heat dissipation, ensuring the FET can operate reliably under varying load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET suitable for a wide range of applications requiring consistent performance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can withstand elevated temperatures, making it suitable for applications where thermal management is critical.

Technical Specifications

Power Field Effect Transistors (FET) 2SK4067(TP-FA) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

2SK4067(TP-FA) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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