Loading...

2SC5658K3T5G

Onsemi

2SC5658K3T5G by Onsemi

2SC5658K3T5G by Onsemi is a NPN BJT transistor with hFE of 120, VCE of 50V, and fT of 180MHz. Ideal for amplifier applications, it operates at up to 150 °C with a collector current of 0.1A. This small outline package features surface mount capability and matte tin terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,165

-

-

-

-

Digiode

USA . 471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

471

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 79 parts In-Stock

1+ parts

$3.305

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$3.305

-

-

-

Kulean Microsystems

USA . 6,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,588

-

-

-

-

SupplyDigital Components

Austria . 2,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,861

-

-

-

-

Problanco Electronics

Mexico . 1,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,654

-

-

-

-

Corphita

USA . 763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

763

-

-

-

-

Native Components

USA . 713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.915

10k+ parts

-

713

-

-

$2.915

-

UHIMA Technologies

Türkiye . 573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

573

-

-

-

-

Corohmni

South Africa . 464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

464

-

-

-

-

TANS Electronics

Latvia . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

269

-

-

-

-

Overview

Unlock the power of high-performance amplification with the 2SC5658K3T5G by Onsemi. Crafted with precision and backed by a trusted manufacturer, this NPN Small Signal Bipolar Junction Transistor (BJT) offers unparalleled quality and reliability. Ideal for a wide range of applications, from audio systems to telecommunications equipment, this transistor is designed to enhance performance and efficiency. Trust in Onsemi to deliver cutting-edge technology that brings value and innovation to your projects. Elevate your circuits with the 2SC5658K3T5G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications, making this transistor versatile in its usage.

Configuration: SINGLE

Single configuration simplifies circuit design and makes it easier to integrate into electronic circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, ensuring high performance in audio and radio frequency applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient soldering onto circuit boards, saving space and enabling automated assembly processes.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design for space-efficient PCB layouts and integration into electronic devices.

Terminal Form: FLAT

Flat terminals ensure secure connections and easy soldering during assembly, contributing to the reliability of the transistor.

No. of Terminals: 3

With 3 terminals, this transistor can be easily connected in circuit configurations for various applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enhances thermal performance, suitable for compact electronic designs.

Minimum DC Current Gain (hFE): 120

High minimum DC current gain ensures consistent amplification performance and low signal distortion in amplifier circuits.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable operation in demanding environments and ensures longevity of the transistor.

Maximum Collector-Emitter Voltage: 50 V

With a high maximum collector-emitter voltage rating, this transistor can handle higher voltages without breakdown, suitable for various power supply applications.

Transistor Element Material: SILICON

Silicon material offers high performance, low noise, and reliability, making it a preferred choice for transistor elements in electronic circuits.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current rating of 0.1 A, this transistor can handle moderate current levels in various amplifier and switching applications.

Terminal Finish: MATTE TIN

Matte tin finish provides a stable and low-resistance contact surface for soldering, ensuring reliable connections in electronic circuits.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connectivity options, allowing for easy integration into electronic designs.

Nominal Transition Frequency (fT): 180 MHz

High nominal transition frequency ensures quick response times and efficient signal processing, making this transistor suitable for high-frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) 2SC5658K3T5G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

120

JESD-30 Code:

R-PDSO-F3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2SC5658K3T5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20