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MT48LC8M16A2P-6AIT

Micron Technology

MT48LC8M16A2P-6AIT by Micron Technology

Micron Technology's MT48LC8M16A2P-6AIT is a 3.3V Synchronous DRAM with 8MX16 organization, operating at up to 167 MHz clock frequency. Ideal for industrial applications, it offers a memory density of 134217728 bits and supports common I/O type with self-refresh capability.

Median Price

$4.354

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.354

100+ parts

-

1k+ parts

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10k+ parts

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50

$4.354

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Chip Stock

USA . 18,500 parts In-Stock

1+ parts

-

100+ parts

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18,500

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Vyrian

USA . 1,628 parts In-Stock

1+ parts

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1,628

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-

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Digiode

USA . 1,565 parts In-Stock

1+ parts

-

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1,565

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-

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

1+ parts

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150

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Huijzer Components

Netherlands . 121 parts In-Stock

1+ parts

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121

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Odintec Ltd.

Israel . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 216 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

-

216

$4.000

$3.900

$3.880

-

Argo Parts USA

USA . 1,560 parts In-Stock

1+ parts

$4.354

100+ parts

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1,560

$4.354

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Continental Prestige Electronics

USA . 172 parts In-Stock

1+ parts

$4.354

100+ parts

-

1k+ parts

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10k+ parts

$4.267

172

$4.354

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-

$4.267

Corohmni

South Africa . 271 parts In-Stock

1+ parts

$4.730

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271

$4.730

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Aztec Data Supply Inc.

USA . 4,199 parts In-Stock

1+ parts

$4.910

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4,199

$4.910

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Ampacity Inc.

Singapore . 1,541 parts In-Stock

1+ parts

$14.000

100+ parts

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1,541

$14.000

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AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$16.674

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595

$16.674

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Corphita

USA . 2,174 parts In-Stock

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2,174

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Infinite Electronics LLP (Excess)

. 2,031 parts In-Stock

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2,031

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.267

1k+ parts

$4.137

10k+ parts

$4.050

1,000

-

$4.267

$4.137

$4.050

Perfect Parts

USA . 987 parts In-Stock

1+ parts

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100+ parts

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987

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Overview

Elevate your electronic devices with the MT48LC8M16A2P-6AIT by Micron Technology, a top-tier manufacturer known for producing high-quality DRAM components. Designed for superior performance and reliability, this synchronous memory module is ideal for a variety of applications. With a compact package style and advanced technology, it offers customers unmatched value and benefits. Upgrade your products with this innovative solution and experience enhanced speed and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable ensures easy installation and space-saving design in compact electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy integration into existing designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and accurate data transfer, making it suitable for high-speed applications.

Self Refresh: YES

Self-refresh capability enhances power efficiency and reduces the need for external refresh circuits in the system.

Input/Output Type: COMMON

Common input/output type simplifies the interface design and enhances compatibility with different systems.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and energy efficiency.

Power Supplies (V): 3.3

The 3.3V power supply ensures stable and reliable operation, making it suitable for various electronic applications.

No. of Terminals: 54

With 54 terminals, this product offers a versatile and flexible connection interface for diverse system configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style save space on the PCB while maintaining high memory capacity.

Technical Specifications

DRAM MT48LC8M16A2P-6AIT attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

167 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

330 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MT48LC8M16A2P-6AIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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