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MPFS095T-1FCSG536E

Microchip Technology

MPFS095T-1FCSG536E by Microchip Technology

MPFS095T-1FCSG536E by Microchip: Operates at 0-100°C, with 536 terminals on a 16x16mm grid array package. Ideal for applications requiring a low-profile, fine-pitch programmable SoC peripheral IC with CMOS technology.

Median Price

$182.380

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

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$182.380

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$148.188

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Distributors (In-Stock)

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Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$247.102

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23

$247.102

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Vyrian

USA . 8,066 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 833 parts In-Stock

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$16.108

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833

$16.108

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$209.660

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3

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Continental Prestige Electronics

USA . 3,018 parts In-Stock

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$247.102

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$242.160

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$242.160

Microchip USA

USA . 2,419 parts In-Stock

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$401.700

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2,419

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Montano Global Distributors

Canada . 7,222 parts In-Stock

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LMD Electronica

Estonia . 2,952 parts In-Stock

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NIA Electronics

USA . 2,670 parts In-Stock

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Ledger Components

France . 2,670 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,209 parts In-Stock

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Argo Parts USA

USA . 1,469 parts In-Stock

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1,469

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MPFS095T-1FCSG536E by Microchip Technology. Known for their top-quality products, Microchip has created a versatile and reliable solution in the category of Other Function uPs,uCs & Peripheral ICs. This programmable SoC offers countless applications and benefits to customers, from its low-profile design to its wide operating temperature range. Embrace innovation and efficiency with this cutting-edge product that will take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to damage, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.03 V

With a maximum supply voltage of 1.03V, this product is suitable for low-power applications and helps in reducing energy consumption.

Package Shape: SQUARE

Square package shape ensures uniform and compact design, optimizing space on the PCB.

No. of Terminals: 536

Having a high number of terminals allows for connectivity to various external components, expanding the functionality of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enables high-density mounting, enhancing the overall performance of the product.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and supports energy-efficient operation.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows the product to withstand tough environmental conditions and ensures reliable performance under stress.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature guarantees functionality in cold environments, making the product versatile and adaptable to different settings.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection and integration with other components, simplifying the design and assembly process.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables a compact form factor, making the product suitable for space-constrained applications.

Width: 16 mm

Optimal width dimension offers a balance between size and performance, allowing for efficient placement on the PCB.

Length: 16 mm

Compact length ensures a streamlined design, enhancing the overall aesthetics and functionality of the product.

Peripheral IC Type: PROGRAMMABLE SoC

Programmable System-on-Chip (SoC) technology provides flexibility and customization options, making the product versatile for a variety of applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

Ball terminal form ensures secure connections and reliable performance under mechanical stress, improving the overall durability of the product.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage of 1V ensures consistent operation and reliability, making the product suitable for critical applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and precise connections, enhancing the overall performance and efficiency of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS095T-1FCSG536E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B536

Length:

16 mm

No. of Terminals:

536

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA536,30X30,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

MPFS095T-1FCSG536E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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