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MPF500T-FCG784I

Microchip Technology

MPF500T-FCG784I by Microchip Technology

MPF500T-FCG784I by Microchip Technology is a CMOS FPGA with 481K logic cells, 388 inputs/outputs, and operates b/w -40 to 100°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high-density programmable logic in compact designs.

Median Price

$884.570

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 2 parts In-Stock

1+ parts

$590.620

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$590.620

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DigiKey

USA . 1 parts In-Stock

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$884.570

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1

$884.570

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Mouser Electronics

USA . 1 parts In-Stock

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$884.570

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1

$884.570

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Verical

USA . 2 parts In-Stock

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$1,138.514

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$1,138.514

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Distributors (In-Stock)

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NAC Semi

USA . 2 parts In-Stock

1+ parts

$707.650

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$663.420

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$707.650

$663.420

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Digiode

USA . 316 parts In-Stock

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$800.840

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316

$800.840

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Electro Sonic

Canada . 2 parts In-Stock

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$902.050

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$902.050

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Nova Conductors

Japan . 50 parts In-Stock

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$1,018.100

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$1,018.100

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IBS Electronics

USA . 2 parts In-Stock

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$1,095.887

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Vyrian

USA . 5,796 parts In-Stock

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Chip Stock

USA . 575 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$11.498

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$11.498

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Semicontronic

India . 2 parts In-Stock

1+ parts

$716.540

100+ parts

$698.626

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$695.044

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$716.540

$698.626

$695.044

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Vigor

Singapore . 383 parts In-Stock

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$727.630

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$727.630

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Corphita

USA . 126 parts In-Stock

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$758.691

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Argo Parts USA

USA . 4,326 parts In-Stock

1+ parts

$1,018.100

100+ parts

$1,007.919

1k+ parts

$997.738

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$987.557

4,326

$1,018.100

$1,007.919

$997.738

$987.557

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1,018.100

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$967.195

10k+ parts

$946.833

2,000

$1,018.100

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$967.195

$946.833

Continental Prestige Electronics

USA . 1,813 parts In-Stock

1+ parts

$1,018.100

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$997.738

1,813

$1,018.100

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$997.738

Ampacity Inc.

Singapore . 2 parts In-Stock

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$1,559.530

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$1,559.530

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NIA Electronics

USA . 8,284 parts In-Stock

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Ledger Components

France . 8,284 parts In-Stock

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LOOK Integrated Logistics

Peru . 7,738 parts In-Stock

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LMD Electronica

Estonia . 7,318 parts In-Stock

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Montano Global Distributors

Canada . 772 parts In-Stock

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Overview

Experience the next level of technology with the MPF500T-FCG784I by Microchip Technology, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA). With its high-quality construction and cutting-edge CMOS technology, this innovative product offers 481,000 logic cells and 388 inputs/outputs for seamless integration into a wide range of applications. Whether you're looking to enhance your computing systems or optimize your industrial processes, the MPF500T-FCG784I delivers unmatched performance and reliability. Upgrade your projects today and unlock endless possibilities with this state-of-the-art FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for portable applications.

No. of Logic Cells: 481000

With a large number of logic cells, this FPGA offers high processing power and versatility for complex designs.

Surface Mount: YES

Being surface mountable, this FPGA is easy to install and suitable for compact PCB designs.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage reduces power consumption and heat generation, making it energy efficient.

Technology Used: CMOS

The CMOS technology ensures high-speed operation and low power consumption, enhancing overall performance.

No. of Inputs: 388

With a generous number of inputs, this FPGA can handle multiple data streams efficiently.

Package Shape: SQUARE

The square package shape allows for easier integration into PCB layouts and provides a compact footprint.

Form Of Terminal: BALL

The ball terminal form factor simplifies the installation process and ensures reliable connections.

No. of Terminals: 784

The abundance of terminals provides ample connectivity options, enabling versatile design capabilities.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA allows for flexible and customizable applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers secure mounting and alignment, ensuring stable connections.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage allows for operation in low power scenarios, making it suitable for battery-powered devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA is reliable in harsh environments.

Pitch Of Terminal: 1 mm

The tight terminal pitch allows for high-density PCB designs, maximizing functionality in limited space.

Minimum Operating Temperature: -40 °C

The wide temperature range capability ensures reliable operation even in extreme cold conditions.

Position Of Terminal: BOTTOM

The bottom terminal position simplifies PCB layout and routing, streamlining the design process.

Maximum Seated Height: 3.47 mm

The low seated height profile enables slim and compact device designs, ideal for space-constrained applications.

Width: 29 mm

With a moderate width, this FPGA offers a balance between integration flexibility and space efficiency.

No. of Outputs: 388

The equal number of outputs to inputs enhances data processing symmetry and efficiency in the FPGA.

Length: 29 mm

The moderate length of the FPGA provides a balanced form factor for various PCB layout considerations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500T-FCG784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF500T-FCG784I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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